CompTIA Network+ Certification Kit
Exam N10-005
Todd Lammle(Author)
Wiley (Publisher)
3rd Edition
Published on 20. March 2012
Book
Paperback/Softback
1584 pages
978-1-118-14865-5 (ISBN)
Article exhausted; check for reprint
Description
If you're preparing to take CompTIA's new Network+ Exam N10-005, this value-priced kit is just what you need. Three essential Sybex guides--CompTIA Network+ Study Guide, 2nd Edition; CompTIA Network+ Review Guide, 2nd Edition; and CompTIA Network+ Lab Manual are packaged into one handy set that includes complete coverage of all exam objectives, real-world exercises, the expertise of seasoned authors, loads of review questions, and plenty of practice exams. You'll find all the tools you need to study, practice, review, and confidently take the exam.
* Value-priced Kit features three Sybex guides to help you prepare for the new CompTIA Network+ Exam N10-005: CompTIA Network+ Study Guide, Second Edition; CompTIA Network+ Review Guide, Second Edition; and CompTIA Network+ Lab Manual
* Covers all exam objectives, provides exercises to hone your real-world skills, and walks you through focused reviews for that last-minute test prep
* Includes plenty of review questions and practice exams
* Value-priced Kit features three Sybex guides to help you prepare for the new CompTIA Network+ Exam N10-005: CompTIA Network+ Study Guide, Second Edition; CompTIA Network+ Review Guide, Second Edition; and CompTIA Network+ Lab Manual
* Covers all exam objectives, provides exercises to hone your real-world skills, and walks you through focused reviews for that last-minute test prep
* Includes plenty of review questions and practice exams
More details
Edition
3. Auflage
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Edition type
Revised edition
Dimensions
Height: 23.3 cm
Width: 18.6 cm
Thickness: 8.2 cm
Weight
1197 gr
ISBN-13
978-1-118-14865-5 (9781118148655)
Schweitzer Classification
Other editions
New editions

Book
06/2015
4th Edition
Wiley
€105.00
Article exhausted; check for reprint