Photonic Packaging Sourcebook
Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Published on 9. October 2016
Book
Paperback/Softback
XIX, 325 pages
978-3-662-52135-9 (ISBN)
Description
This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
More details
Edition
Softcover reprint of the original 1st ed. 2015
Language
English
Place of publication
Berlin
Germany
Publishing group
Springer Berlin
Target group
Professional and scholarly
Illustrations
16 farbige Abbildungen, 271 s/w Abbildungen
XIX, 325 p. 287 illus., 16 illus. in color.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 19 mm
Weight
528 gr
ISBN-13
978-3-662-52135-9 (9783662521359)
DOI
10.1007/978-3-642-25376-8
Schweitzer Classification
Other editions
Additional editions
Ulrich H. P. Fischer-Hirchert
Photonic Packaging Sourcebook
Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Book
04/2015
Springer
€181.89
Shipment within 7-9 days
Person
Prof. Dr. rer .nat. Dr.-Ing. habil Ulrich Fischer-Hirchert is CEO of HarzOptics GmbH, Wernigerode, and Professor of Communication Technics at the Harz University of Applied Sciences, Wernigerode.
Content
Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.