
Photonic Packaging Sourcebook
Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Ulrich H. P. Fischer-Hirchert(Author)
Springer (Publisher)
Published on 22. April 2015
Book
Hardback
XIX, 325 pages
978-3-642-25375-1 (ISBN)
Description
This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
More details
Edition
2013
Language
English
Place of publication
Berlin
Germany
Publishing group
Springer Berlin
Target group
Professional and scholarly
Professional/practitioner
Illustrations
271 s/w Abbildungen, 16 farbige Abbildungen
XIX, 325 p. 287 illus., 16 illus. in color.
Dimensions
Height: 241 mm
Width: 160 mm
Thickness: 25 mm
Weight
688 gr
ISBN-13
978-3-642-25375-1 (9783642253751)
DOI
10.1007/978-3-642-25376-8
Schweitzer Classification
Other editions
Additional editions

Ulrich H. P. Fischer-Hirchert
Photonic Packaging Sourcebook
Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Book
10/2016
Springer
€128.39
Shipment within 7-9 days

Ulrich H. P. Fischer-Hirchert
Photonic Packaging Sourcebook
Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
E-Book
04/2015
1st Edition
Springer
€117.69
Available for download
Person
Prof. Dr. rer .nat. Dr.-Ing. habil Ulrich Fischer-Hirchert is CEO of HarzOptics GmbH, Wernigerode, and Professor of Communication Technics at the Harz University of Applied Sciences, Wernigerode.
Content
Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.