Ultra-Precision Machining Technologies, CJUMP2011
Published on 26. April 2012
Software
Digital media
410 pages
978-3-03795-218-4 (ISBN)
Description
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.
More details
Series
Language
English
Place of publication
Zurich
Switzerland
Target group
College/higher education
Professional and scholarly
Dimensions
Height: 142 mm
Width: 125 mm
Thickness: 10 mm
Weight
200 gr
ISBN-13
978-3-03795-218-4 (9783037952184)
DOI
10.4028/www.scientific.net/AMR.497
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Trans Tech Publications Ltd | Ju Long Yuan | Hitoshi Ohmori
Ultra-Precision Machining Technologies, CJUMP2011
Book
04/2012
Trans Tech Publications Ltd
€276.53
Article exhausted; check different version
Ju Long Yuan | Hitoshi Ohmori | Bing Hai Lv
Ultra-Precision Machining Technologies, CJUMP2011
E-Book
04/2012
Trans Tech Publications Ltd
€211.86
Available for download
Content
Experiment and Discussion on Ultrasonic Vibration-Assisted Single Point Diamond Turning of Die SteelsA Novel Orderly Arrangement Method Controlled by Magnetic Field for Diamond Abrasives of Grinding WheelInfluence of Cup Wheel Grinding and Etching Pretreatment on Residual Stress and Surface Topography for Coated Cemented Carbide ToolsPrecision Grinding of Structured Tungsten Carbide MoldAnalysis on Kinematic Characteristics of Precision Balls GrindingStudy on Machining Characteristics of Sawing Al2O3 Ceramic with Diamond Cut-Off WheelWear Mechanism of High-Speed Turning Ti-6Al-4V with TiAlN and AlTiN Coated Tools in Dry and MQL ConditionsStudy on Fracture Performance of In Situ Growth Whisker Toughened Composite Ceramic ToolThe Performances of Different Coated Carbide Drills when Drilling a Cast Nickel-Based AlloyNew Approach for Noncircular Following Grinding of Crankshaft PinStudy on the Process of Gear Shaft Formed by Cross Wedge Rolling Based on DeformResearch on the Surface Roughness Predictive Model of Austempered Ductile Iron Based on Genetic AlgorithmStudy on Dynamic Stiffness of Machine Tool with Consideration of Friction Damping in GuideFabrication and Cutting Performance of CVD Diamond Coated Inserts with Different Coating Thickness in Dry Turning Aluminum AlloyInfluence of Diameter and Number of Orifice on Static Characteristics of Radial-Thrust Aerostatic BearingResearch on High Performance Vitrified Bond Diamond WheelOptimum Design for the Frame of Open Type Abrasive Flow Polish MachineCutting Performance and Failure Mechanisms of Coated Carbide Tools in Face Milling Powder Metallurgy Nickel-Based SuperalloyStudy on Dynamic Characteristics of a Hydrostatic and Hydrodynamic Journal Bearings for Small Diameter Grinding SpindleCurrent Research Trends on Resin Bond Used for Abrasive ProductsInfluence of Soluble Filler on the Mechanical Properties of Porous Self-Generation Superabrasive ToolResearch on Soil Vibratory Cutting with ALE Finite Element Simulation MethodTransient Heat Transfer Simulation in Rapid Heat Cycle Molding with Electric HeatingTool Breakage Feature Extraction in PCB Micro-Hole Drilling Using Vibration SignalsEffects of Process Parameters on Surface Gloss in Rapid Heat Cycle Molding ProcessNew Measurement Concept of Nanometer-Level Defects on Si Wafer Surface by Using Micro Contact SensorAbsolutely Testing of Off-Axis Aspherical Mirror Using Dichotomy Computer-Generated HologramsDual-Servo Mechanism of STM for Measurement of Sub Millimeter Deep Trench StructuresThe Acoustic Micro Integrated Detection Technique for Silicon Wafer ProcessingXTEM Observation of 4H-SiC (0001) Surfaces Processed by Plasma Assisted PolishingPlasma Chemical Vaporization Machining of Silicon Carbide Wafer Using Flat-Bar Electrode with Multiple Gas NozzlesSimulation of Large Scale KDP Crystal Polishing by Computer Controlled Micro-Nano DeliquescenceStudy of Magnetorheological Brush Finishing (MRBF) for Concave Surface of Conformal OpticsThe Composite Ultra-Precision Processing Technology for the Small Aspheric Mould of Stainless SteelAnalyze and Verify Cutting Depth Distribution of Different Grits Size SFAPCVD Diamond Film Polishing Based on Accelerant TheoryA New Method for Free Surface Polishing Based on Soft-Consolidation Abrasive Pneumatic WheelA Study of the Solid-State Reaction for Polishing SapphiresStudy on Polishing Technology of GaAs WaferNew Researches for Fabrication of Micro-Pin in Micro-ECMThree-Dimensional Surface Error Reconstruction and Ion Beam Figuring of Optical HemisphereExperimental Research on Microburrs of High Speed Drilling of PCB Using MicrodrillUltrashort Pulsed Laser Micromachining of Polycrystalline DiamondFabrication of Polycrystalline Diamond Tools by Micro Electrodischarge MachiningUltra-Wide Car Lens Optimization Based on Low-Tg Aspheric GlassSize Effects on Transferability and Mold Change of Glass Molding Press for MicrogroovesFinite Element Analysis on Non-Isothermal Glass MoldingApplication of Orthogonal Test in Numerical Simulation of Glass Lens MoldingStudy on Material Removal Rate of CMP 6H-SiC Crystal Substrate (0001) C Surface Based on Abrasive Alumina (Al2O3)Effect of Pad Surface Asperity on Removal Rate in Chemical Mechanical PolishingDevelopment of Novel Groove Patterns for CMP PadResearch on Process Parameters Intellectual Decision Support System for High Efficiency and Precision CMP Function CeramicsExperimental Study of Material Removal Rate for Rotary Curved Surface Workpieces of Si3N4 in Chemical-Mechanical Polishing Using Taguchi TechniqueStudy on Groove Shape of CMP Polishing Pad: A ReviewResearch on the Fracture Property of Glass Plate under Uniform PressureFEA on Deformation Behavior of Glass Plate in Elastic Deformation Machining ProcessResearch on Ultra-Precision Machining of Silicon Nitride Ceramics: A ReviewResearch on Tool Wear and Surface Characteristics in Ultrasonic Milling Carbon Fibre Reinforced Carbon CompositeOptical Performance of a Laser Point Source Strongly Emitted by an Aspheric ExpanderNanoparticulate-Reinforced Ti-Base Composites Prepared by Laser CladdingElectrochemical Machining of Micro Slots Using Shaped ElectrodeCAD/CAM System of Micro-WEDM for a Micro-Air Journal Bearing FabricationNumerical Simulation on Vibration-Assisted Ultra-Precision Cutting of Steel AISI 1045 with PCD ToolResearch on Processing Mechanism of Multi-Cell-DiscA Study on Feeding Technology of Motorbike Crankcase in Multidirection Squeeze CastingResearch and Simulation of the Temperature on Multi-Squeeze CastingInfluence of Low-Temperature Freezing Treatment on Micro-Area Hardness and Residual Stress of SiCp/Al CompositesSimulation on Hydraulic Performance of Two Kinds of Coring Diamond Bits with Different CrownNumerical Simulation for Cold Extrusion of Bevel GearDevelopment of Electric Rust Preventive Machining Method - Correspond to Difference of Water in World: Use of Deionized Refined WaterDevelopment of Electric Rust Preventive Machining Method - Correspond to Difference of Water in World: Use of Adjusted Synthesized WaterPath Optimization of the Drilling Hole Based on Genetic AlgorithmGasify Micro-Oil Ignition Technology Based on Level Set Methods