Surface Finishing Technology and Surface Engineering

Compound Finish Processes Using Burnishing and Ultrasonic Electrochemical Finishing on Hole-Wall SurfaceSimulation of Flows Field Characteristics in the Nozzle of Two-Phase Compulsive Circulation Flows FinishingProcess Characteristics Research on Horizontal Spindle Barrel FinishingModeling and Experiment of Anodic Smoothening in Electrochemical Finishing Based on Lateral Direction DissolutionExperimental Investigation on Electrochemical Finishing Machining of Stainless Steel in Passive Electrolyte SolutionCompliant Control at Micro-Displacement in Hydrodynamic Suspension Ultra-Smooth MachiningTheoretical Analysis and Experimental Verification of Validity Finished by Abrasive Jet with Grinding Wheel as RestraintComputer Simulation on Centrifugal Barrel Surface Finishing Based on Discrete Element MethodMechanism Research on the Swirling Air Flow Compounded with Magnetic-Field FinishingMaterial Removal Mechanism in Vibration-Assisted Magnetic Abrasive FinishingInternal Magnetic Abrasive Particles Surface Finishing Based on Permanent Magnetic FieldFinite Element Modeling of Burr Formation in Orthogonal Metal CuttingFormation and Simulation of Two-Side Burr in Orthogonal CuttingStudy on Burr Formation in Face Milling of Stainless Steel with Chamfered Cutting Tool The Effect of Shear Strain on Transformation between Burr and Negative Burr Numerical Study of the Effect of Tool Wear on Burr Formation in Blanking ProcessTransformation of Cutting Burr/Fracture in High-Speed Machining Al AlloyPolishing of Free-Standing CVD Diamond Films by the Combination of EDM and CMP Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement TrajectoriesFriction-Based In Situ Endpoint Detection of Copper CMP ProcessResearch on Mechanism of Chemical Mechanical Polishing Process for Silicon Nitride Balls with CeO2 AbrasivePolishing Processing to Internal Surface of Non-Magnetic Pipe by Magnetic Abrasive FinishingSurface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy FilmsStudy on the Evaluation Method of Lapping Uniformity for Ceramic BallsDevelopment of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological EffectExperimental Validation of the ?Trap? Effect of the Semibonded Abrasive Grinding Plate Effect of Ice Counterparts on the Friction Behavior of Single Crystal Silicon Wafer Machining Characteristics of Semibonded Abrasive Grinding PlateThe Analysis for Materials Removal Mechanism of Ultrasonic Auxiliary Gear Honing Test Research on the Optimizing Technological Parameters of the Ultrasonic Vibration HoningResearch on System Design of Ultrasonic-Assisted Honing of GearsStudy on the Database about Floating Polishing Technological ParametersInfluence of Grinding to the Surface and Subsurface Quality of KDP CrystalStudy on Effect of Grinding Fluid Supply Parameters on Surface Integrity in Quick-Point Grinding for Green ManufacturingPassivation Model of Diamond Wheel for Grinding Si3N4 CeramicsThe Finite Element Analysis of Surface Temperature on Dry Belt Grinding for Titanium AlloysModeling and Computer Simulation of Grinding for Ball-End Milling Cutter with Equal Normal Rake AngleGrinding at Very Low SpeedExperiment Study on Vitrified Bonded Wheels of Quick-Point GrindingResearch on Surface Roughness and Micro-Topography of Nano-ZrO2 Plate in Two-Dimension Ultrasonic GrindingExperimental Research on the Cooling Effects of a New High Efficiency Green Cooling MethodStudy on Fiber Laser Assisted Truing and Dressing of Diamond Wheel In-ProcessMeasurement and Evaluation of the Geometric Error of Precision Machined Spherical SurfaceNovel Measurement Technique on 3D Surface Topography of Polishing PadSurface Topography Characteristics in Ultrasonic Aided High Speed Lapping of Engineering CeramicsStudy on the Effect of Grinding Parameters to the White Layer Formation in Grinding SKD-11 Hardened SteelThe Properties and the Influence Factors of the White Layer in the Surface GrindingThe Characteristics of Surface Residual Stresses by Plane Grinding Invar and the Effects of Them on Structural StabilitySimulation System for Quality Prediction and Parameters Optimization when Machining Ceramics Die MaterialSurface Integrity and Fatigue Property of a High Speed Milled Titanium AlloySurface Integrity Induced by Abrasive Machining Sapphire WaferStudy on Variable Spot Cladding for Large Area Laser Surface ModificationCone-Shaped Hard Carbon Films Grown by Inductively Coupled RF Plasma with RF or DC Bias VoltageInfluence of Surface Morphology of Diamond Films on their Frictional Behaviors in Dry and Water EnvironmentsLaser Power Characterization Method for Fabrication of Centrosymmetric CR-DOEs MaskCharacteristic of Si-Doped DLC Films on TC4 and Cr12 SubstratesA New Solar Selective Absorbing Structure of Al-Al2O3 Cermet Composite Films by Pulsed Direct Current Magnetron SputteringA Study of Cavitation Induced Surface Erosion in Abrasive Waterjet Cutting SystemsStudy on Removal Mechanism of Nanoparticle Colloid Jet Machining2D Simulation of the Gas-Solid Two Phase Flow inside the Abrasive Jet (AJ) NozzleTemperature Dependence and Effect on Surface Roughness in Abrasive Flow MachiningResearch on Small Dimension Precision Turning Technology for Internal Spherical SurfaceDry WEDM in Improving LS-WEDMed Surface QualityA Study on Abrasion-Assisted Electrodeposition of Bright NickelOptimization of Cutting Force by Exponential Model in Milling Heat-Resistant Steel F91Effects of Non-Electrical Parameters on Material Removal Rate of High-Speed Small Hole EDM DrillingNumerical Simulation of Liquid-Solid Two-Phase Flow Field in Discharge Gap of High-Speed Small Hole EDM DrillingFEM Analysis and Experimental Study on Residual Stress Induced by Form-Milling and Rolling of Rotor Steel 26NiCrMoV145Parameter Selection Rules for Error Separation by Multi-Probe Method