Digital Circuit Boards - Mach 1 GHz

Preface xi 1 BASICS 1 1.1 Introduction 1 1.2 Why the Field Approach is Important 3 1.3 The Role of Circuit Analysis 4 1.4 Getting Started 5 1.5 Voltage and the Electric Field 6 1.6 Current 7 1.7 Capacitance 8 1.8 Mutual and Self-Capacitance 10 1.9 E Fields Inside Conductors 11 1.10 The D Field 12 1.11 Energy Storage in a Capacitor 12 1.12 The Energy Stored in an Electric Field 13 1.13 The Magnetic Field 13 1.14 Rise Time/Fall Time 15 1.15 Moving Energy into Components 15 1.16 Faraday's Law 16 1.17 Self- and Mutual Inductance 16 1.18 Poynting's Vector 17 1.19 Fields at DC 18 2 TRANSMISSION LINES 22 2.1 Introduction 22 2.2 Some Common Assumptions 24 2.3 Transmission Line Types 25 2.4 Characteristic Impedance 27 2.5 Wave Velocity 29 2.6 Step Waves on a Properly Terminated Line 30 2.7 The Open Circuited Transmission Line 31 2.8 The Short Circuited Transmission Line 33 2.9 Waves that Transition between Lines with Different Characteristic Impedances 35 2.10 Nonlinear Terminations 38 2.11 Discharging a Charged Open Transmission Line 38 2.12 Ground/Power Planes 40 2.13 The Ground and Power Planes as a Tapered Transmission Line 41 2.14 Pulling Energy from a Tapered Transmission Line (TTL) 43 2.15 The Energy Flow Through Cascaded (Series) Transmission Lines 45 2.16 An Analysis of Cascaded Transmission Lines 48 2.17 Series (Source) Terminating a Transmission Line 49 2.18 Parallel (Shunt) Terminations 50 2.19 Stubs 52 2.20 Decoupling Capacitor as a Stub 54 2.21 Transmission Line Networks 54 2.22 The Network Program 55 2.23 Measuring Characteristic Impedance 56 3 RADIATION AND INTERFERENCE COUPLING 61 3.1 Introduction 61 3.2 The Nature of Fields in Logic Structures 62 3.3 Classical Radiation 62 3.4 Radiation from Step Function Waves 63 3.5 Common Mode and Normal Mode 66 3.6 The Radiation Pattern along a Transmission Line 70 3.7 Notes on Radiation 70 3.8 The Cross Coupling Process (Cross Talk) 71 3.9 Magnetic Component of Cross Coupling 72 3.10 Capacitive Component of Cross Coupling 74 3.11 Cross Coupling Continued 75 3.12 Cross Coupling between Parallel Transmission Lines of Equal Length 76 3.13 Radiation from Board Edges 78 3.14 Ground Bounce 79 3.15 Susceptibility 80 4 ENERGY MANAGEMENT 82 4.1 Introduction 82 4.2 The Power Time Constant 84 4.3 Capacitors 86 4.4 The Four-Terminal Capacitor or DTL 87 4.5 Types of DTLs 89 4.6 Circuit Board Resonances 90 4.7 Decoupling Capacitors 90 4.8 The Board Decoupling Problem 92 4.9 The IC Decoupling Problem 93 4.10 Comments on Energy Management 94 4.11 Skin Effect 95 4.12 Dielectric Losses 97 4.13 Split Ground/Power Planes 97 4.14 The Analog/digital Interface Problem 98 4.15 Power Dissipation 99 4.16 Traces through Conducting Planes 100 4.17 Trace Geometries that Reduce Termination Resistor Counts 101 4.18 The Control of Connecting Spaces 101 4.19 Another way to look at Energy Flow in Transmission Lines 103 5 SIGNAL INTEGRITY ENGINEERING 106 5.1 Introduction 106 5.2 The Envelope of Permitted Logic Levels 107 5.3 Net Lists 108 5.4 Noise Budgets 108 5.5 Logic Level Variation 109 5.6 Logic and Voltage Drops 110 5.7 Measuring the Performance of a Net 111 5.8 The Decoupling Capacitor 112 5.9 Cross Coupling Problems 114 5.10 Characteristic Impedance and the Error Budget 114 5.11 Resistor Networks 116 5.12 Ferrite Beads 117 5.13 Grounding in Facilities: A Brief Review 118 5.14 Grounding as Applied to Electronic Hardware 120 5.15 Internal Grounding of a Digital Circuit Board 123 5.16 Power Line Interference 124 5.17 Electrostatic Discharge 125 6 CIRCUIT BOARDS 130 6.1 Introduction 130 6.2 More about Characteristic Impedance 131 6.3 Microstrip 133 6.4 Centered Stripline 135 6.5 Embedded Microstrip 136 6.6 Asymmetric Stripline 137 6.7 Two-Layer Boards 140 6.8 Four-Layer Circuit Board 143 6.9 Six-Layer Boards 145 Glossary 147 Abbreviations and Acronyms 149 Bibliography 157 Index 159