3D IC and RF SiPs - Advanced Stacking and Planar Solutions for 5G Mobility
Published on 31. March 2018
Software
Other digital
464 pages
978-1-119-28965-4 (ISBN)
More details
Language
English
Place of publication
Hoboken
United Kingdom
Publishing group
John Wiley and Sons Ltd
Target group
Professional and scholarly
Dimensions
Height: 250 mm
Width: 150 mm
Thickness: 15 mm
Weight
666 gr
ISBN-13
978-1-119-28965-4 (9781119289654)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Lih-Tyng Hwang | Tzyy-Sheng Jason Horng
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
E-Book
03/2018
1st Edition
Wiley
€114.99
Available for download
Lih-Tyng Hwang | Tzyy-Sheng Jason Horng
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
E-Book
03/2018
1st Edition
Wiley
€117.99
Available for download