
Manufacturing Sciences and Technologies X
Trans Tech Publications Ltd (Publisher)
Will be published approx. on 9. July 2020
Software
Digital media
222 pages
978-3-0357-2657-2 (ISBN)
Description
This volume contains papers that were presented at the the 10th "International Conference on Manufacturing Science and Technology" (ICMST 2019), 3rd "International Conference on Sensors, Materials and Manufacturing" (ICSMM 2019) and 2019 "International Conference on Functional Materials and Applied Technologies" (FMAT 2019). Collected papers reflect the last research results in the field of materials science, modern processing technologies and methods of choosing and optimization of technological parameters.
More details
Series
Language
English
Place of publication
Switzerland
Publishing group
Trans Tech Publications
Target group
Professional and scholarly
Dimensions
Height: 142 mm
Width: 125 mm
Thickness: 10 mm
Weight
200 gr
ISBN-13
978-3-0357-2657-2 (9783035726572)
DOI
10.4028/www.scientific.net/SSP.305
Schweitzer Classification
Other editions
Additional editions

Shen-Ming Chen | Sujan Debnath
Manufacturing Sciences and Technologies X
Book
07/2020
Trans Tech Publications Ltd
€247.60
Shipment within 10-20 days

Shen-Ming Chen | Sujan Debnath
Manufacturing Sciences and Technologies X
E-Book
06/2020
Trans Tech Publications Ltd
€211.86
Available for download
Content
The Effects of Alkalization on Mechanical and Physical Properties of Bamboo-Polypropylene CompositeEnhancing Mechanical Performance of Bagasse Fiber-Epoxy Composite by Surface TreatmentThe Effect of Aging on the Decrease in Tensile Strength of Composites with Palm Oil Kernel Shell PowderImprovement of Binderless Banana Pseudo-Stem Particleboard Properties via Natural Laminating MaterialsDegradation Behaviour of Nanosilica Enhanced Oil Palm Empty Fruit Bunch Fiber Epoxy CompositesCeramic Membrane Production from the Mixture Composition of Clay, Zeolite, Activated Carbon with Micro Particle SizeThe Process Development for Sound Absorption Design of Non-Woven Car MatAn Experimentally and Numerically Comparison between E-Glass/Epoxy and Basalt/Epoxy Pipes Pressurized InternallyContactless Chip Module Defect ReductionPreparation of Rutile TiO2 Film by Low Temperature HydrothermalCorrosion of the Materials in the Electrical ConnectorsDouble Perovskite Bi2FeCrO6 Thin Films for PhotovoltaicsA Comparison on Column Reinforcement with Conventional Concrete and Carbon Fiber / Epoxy Exposed to Compression LoadingCharacterization of Geopolymer Binder Using Sidoarjo MudEco-Friendly Thermal Insulation Structures Based on Natural and Biodegradable Materials for Environmentally Durable DevelopmentComparison and Transmission Studies of Commercial Glass and Laminated Glass with PDLC Film for Heat Resistant and Other Building Structure ApplicationsEffect of Ultrasonic Surface Rolling Process Parameters on Surface Properties of S30408 Austenitic Stainless SteelEffect of Coolant Type on Surface Roughness and RSM Modelling in Single-Point Diamond Turning of RSA443 Optical AluminumMachinability and Delamination Studies on Glass Fiber Reinforced Polymer Matrix Composite Cut by Abrasive Water Jet MachineEffects of Helium Addition to Ar-Based Shielding Gas on the Lap-Joint Performance of 5052 Aluminum Alloy to Galvanized Steel Sheet during the MIG Weld-Brazing ProcessImplementation of Neural Network in Classifying the Product Quality for the ABS MetallizationDefect Reduction in Forming Process of Fired Clay Floor Tiles by Six Sigma ApproachChipping Size Reduction on Ultra-Thin Wafers and Narrow Saw-Streets for Wafer Sawing ProcessEnergy Consumption Prediction Model of SiCp/Al Composite in Grinding Based on PSO-BP Neural NetworkApplication of Neural Network in Predicting Forging HardnessSimulation Based Mold Design Optimization of a Spring Flap CastingComparative Study of Optical Silicon Nanomachining Experimental Results and MD Simulation OutputsEffect of Process Parameters on Surface Roughness in Surface Grinding of 90CrSi Tool SteelFinite Element Stress Characterization of Stacked Die Package for Reliability Improvement and Architecture Optimization