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Your search for Electronic Packaging

  1. Cover: Advanced Routing of Electronic Modules - CRC Press
    Michael Pecht | Yeun Tsun Wong
    Advanced Routing of Electronic Modules
    11/2024
    1st EDN1st Edition
    CRC Press
    9781040289020 (ISBN)
    E-Book
    ePUB
    Other editions
    €244.99
    Available for download
  2. Cover: Advanced Routing of Electronic Modules - CRC Press
    Michael Pecht | Yeun Tsun Wong
    Advanced Routing of Electronic Modules
    11/2024
    1st EDN1st Edition
    CRC Press
    9781040292419 (ISBN)
    E-Book
    PDF
    Other editions
    €244.99
    Available for download
  3. Cover: Electronic Packaging Materials and Their Properties - CRC Press
    Michael Pecht | Rakish Agarwal | F. Patrick McCluskey
    Electronic Packaging Materials and Their Properties
    12/2017
    CRC Press
    9781498730860 (ISBN)
    E-Book
    PDF
    Other editions
    €225.99
    Available for download
  4. Cover: High-Frequency Characterization of Electronic Packaging - Springer
    Luc Martens
    High-Frequency Characterization of Electronic Packaging
    11/2013
    Springer
    9781461556237 (ISBN)
    E-Book
    PDF
    Other editions
    €96.29
    Available for download
  5. Cover: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Springer
    Dean L. Monthei
    Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
    11/2013
    Springer
    9781461551119 (ISBN)
    E-Book
    PDF
    Other editions
    €96.29
    Available for download
  6. Cover: Electronic Packaging Materials and Their Properties - CRC Press
    Michael Pecht | Rakish Agarwal | F. Patrick McCluskey
    Electronic Packaging Materials and Their Properties
    12/2017
    CRC Press
    9781351830041 (ISBN)
    E-Book
    ePUB
    Other editions
    €225.99
    Available for download
  7. Cover: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Springer
    Dean L. Monthei
    Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
    03/2014
    Springer
    9781461373254 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €106.99
    Shipment within 7-9 days
  8. Cover: High-Frequency Characterization of Electronic Packaging - Springer
    Luc Martens
    High-Frequency Characterization of Electronic Packaging
    02/2014
    Springer
    9781461375739 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €106.99
    Shipment within 7-9 days
  9. Cover: Thermal Design of Liquid Cooled Microelectronic Equipment - American Society of Mechanical Engineers,U.S.
    Lian-Tuu Yeh
    Thermal Design of Liquid Cooled Microelectronic Equipment
    07/2019
    American Society of Mechanical Engineers,U.S.
    9780791861936 (ISBN)
    Book
    Hardback
    €120.50
    Article not available at the moment
  10. This image is currently not available.
    Daniel Amey | Jurgen Diekmann
    Printed Wiring Boards and Other Interconnection Technologies for High Performance Systems
    McGraw-Hill Inc.,US
    9780070016149 (ISBN)
    Book
    Hardback
    €59.37
    The article will not be published
  11. Cover: Thermal Management of Microelectronic Equipment - American Society of Mechanical Engineers,U.S.
    Lian-Tuu Yeh
    Thermal Management of Microelectronic Equipment
    Heat Transfer Theory, Analysis Methods, and Design Practices
    06/2016
    2nd EDN2nd Edition
    American Society of Mechanical Engineers,U.S.
    9780791861097 (ISBN)
    Book
    Hardback
    €166.60
    Shipment within 15-20 days
  12. Cover: Thermal Management of Telecommunications Equipment - American Society of Mechanical Engineers,U.S.
    Lian-Tuu Yeh | Richard C. Chu
    Thermal Management of Telecommunications Equipment
    11/2013
    American Society of Mechanical Engineers,U.S.
    9780791860205 (ISBN)
    Book
    Hardback
    €138.00
    Shipment within 15-20 days
  13. Cover: Untersuchungen zur Korrelation zwischen Mikrostrukturveränderungen und Belastungsprofilen in bleifreien Lötverbindungen der Oberflächenmontage - Detert, M
    Antje Steller | Klaus J. Wolter | Thomas Zerna
    Untersuchungen zur Korrelation zwischen Mikrostrukturveränderungen und Belastungsprofilen in bleifreien Lötverbindungen der Oberflächenmontage
    09/2014
    Detert, M
    9783934142688 (ISBN)
    Book
    Paperback/Softback
    €29.99
    No shipping information available
  14. Cover: Untersuchungen zum Mechanismus der Porenentstehung in Weichlotverbindungen beim Reflowlöten - Detert, M
    Thomas Ewald | Klaus J. Wolter | Thomas Zerna
    Untersuchungen zum Mechanismus der Porenentstehung in Weichlotverbindungen beim Reflowlöten
    06/2013
    1st EDN1st Edition
    Detert, M
    9783934142473 (ISBN)
    Book
    Paperback/Softback
    €35.00
    No shipping information available
  15. Cover: Systemintegration in der Elektronik durch die Nutzung flexibler Verdrahtungsträger - Detert, M
    Markus Detert | Klaus J. Wolter | Thomas Zerna
    Systemintegration in der Elektronik durch die Nutzung flexibler Verdrahtungsträger
    03/2013
    1st EDN1st Edition
    Detert, M
    9783934142459 (ISBN)
    Book
    Paperback/Softback
    €45.00
    No shipping information available
  16. Cover: Anwendung datenbasierter Analysemethoden für die Steigerung der Produktqualität in der Elektronikfertigung - Detert, M
    Sebastian Meyer | Klaus J. Wolter | Thomas Zerna
    Anwendung datenbasierter Analysemethoden für die Steigerung der Produktqualität in der Elektronikfertigung
    07/2014
    Detert, M
    9783934142466 (ISBN)
    Book
    Paperback/Softback
    €35.00
    No shipping information available
  17. Cover: Simulationsgestützte Optimierung von Fertigungsabläufen in der Produktion elektronischer Halbleiterspeicher - Detert, M
    Sven Horn | Klaus J. Wolter | Thomas Zerna
    Simulationsgestützte Optimierung von Fertigungsabläufen in der Produktion elektronischer Halbleiterspeicher
    10/2008
    1st EDN1st Edition
    Detert, M
    9783934142305 (ISBN)
    Book
    Hardback
    €29.99
    No shipping information available
  18. Cover: Einsatz von Carbon Nanotubes in Aufbau- und Verbindungstechnikstrukturen - Detert, M
    Matthias Heimann | Klaus J. Wolter | Thomas Zerna
    Einsatz von Carbon Nanotubes in Aufbau- und Verbindungstechnikstrukturen
    12/2010
    1st EDN1st Edition
    Detert, M
    9783934142404 (ISBN)
    Book
    Paperback/Softback
    €29.99
    No shipping information available
  19. Cover: Beiträge zur Aufbau- und Verbindungstechnik für optische Kurzstreckenverbindungen - Detert, M
    Krzysztof Nieweglowski | Klaus J. Wolter | Thomas Zerna
    Beiträge zur Aufbau- und Verbindungstechnik für optische Kurzstreckenverbindungen
    05/2011
    1st EDN1st Edition
    Detert, M
    9783934142411 (ISBN)
    Book
    Paperback/Softback
    €35.00
    No shipping information available
  20. Cover: Beiträge zur viskoelastischen Charakterisierung polymerer Werkstoffe der Aufbau- und Verbindungstechnik der Elektronik - Detert, M
    Björn Böhme | Klaus J. Wolter | Thomas Zerna
    Beiträge zur viskoelastischen Charakterisierung polymerer Werkstoffe der Aufbau- und Verbindungstechnik der Elektronik
    05/2012
    1st EDN1st Edition
    Detert, M
    9783934142428 (ISBN)
    Book
    €29.99
    No shipping information available
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