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Your search for EEP S.

  1. This image is currently not available.
    R.A. Pearson
    Application of Fracture Mechanics in Electronic Packaging and Materials: International Mechanical Engineering Congress and Exposition, San Francisco, California, November 12-17, 1995
    01/1995
    American Society of Mechanical Engineers,U.S.
    9780791817360 (ISBN)
    Book
    Hardback
    €109.13
    Shipment within 15-20 days
  2. This image is currently not available.
    Ephraim Suhir
    Structural Analysis in Microelectronic and Fiber Optic Systems: International Mechanical Engineering Congress and Exposition, San Francisco, California, November 12-17, 1995
    01/1995
    American Society of Mechanical Engineers,U.S.
    9780791817377 (ISBN)
    Book
    Hardback
    €101.71
    Shipment within 15-20 days
  3. This image is currently not available.
    D. Agonafer | C.H. Amon | et al
    Application of Heat Transfer in Microelectronic Packaging: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997
    01/1997
    American Society of Mechanical Engineers,U.S.
    9780791818527 (ISBN)
    Book
    Hardback
    €104.18
    Article not available
  4. This image is currently not available.
    J. Suhling
    Applications of Experimental Mechanics of Electronic Packaging: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997
    01/1997
    American Society of Mechanical Engineers,U.S.
    9780791818503 (ISBN)
    Book
    Hardback
    €112.85
    Article not available
  5. This image is currently not available.
    D.; Fulton Agonafer
    Application of CAE/CAD to Electronic Systems: International Mechanical Engineering Congress and Exposition, Atlanta, Georgia, November 17-22, 1996
    01/1996
    American Society of Mechanical Engineers,U.S.
    9780791815533 (ISBN)
    Book
    Hardback
    €94.28
    Article not available
  6. This image is currently not available.
    Asme Conference Proceedings | J. C. Suhling
    Applications of Experimental Mechanics to Electronmic Packaging: International Mechanical Engineering Congress and Exposition, San Francisco, California, November 12-17, 1995
    01/1995
    American Society of Mechanical Engineers,U.S.
    9780791817391 (ISBN)
    Book
    Hardback
    €85.61
    Article not available