6 results
Type of media (2)
Availability (2)
Classification (4)
Year
Persons
Publishers
Sort by
Results per page
Filter
6 results

Your search for Y.C. Lee

  1. Cover: Manufacturing Challenges in Electronic Packaging - Springer
    Y.C. Lee | W.T. Chen
    Manufacturing Challenges in Electronic Packaging
    12/2012
    Springer
    9781461558033 (ISBN)
    E-Book
    PDF
    Other editions
    €96.29
    Available for download
  2. Cover: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Springer
    Ephraim Suhir | Y.C. Lee | C.P. Wong
    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
    05/2007
    1st EDN1st Edition
    Springer
    9780387329895 (ISBN)
    E-Book
    PDF
    Other editions
    €523.23
    Available for download
  3. Cover: Manufacturing Challenges in Electronic Packaging - Springer
    Y.C. Lee | W.T. Chen
    Manufacturing Challenges in Electronic Packaging
    09/2012
    Springer
    9781461376590 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €106.99
    Shipment within 7-9 days
  4. Cover: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Springer
    Ephraim Suhir | Y.C. Lee | C.P. Wong
    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
    08/2016
    Springer
    9781489978851 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €599.98
    Exhausted; check different version
  5. Cover: Manufacturing Challenges in Electronic Packaging - Chapman and Hall
    Y.C. Lee | W.T. Chen
    Manufacturing Challenges in Electronic Packaging
    12/1997
    Chapman and Hall
    9780412620300 (ISBN)
    Book
    Hardback
    Other editions
    €106.99
    Shipment within 10-20 days
  6. Cover: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Springer
    Ephraim Suhir | Y.C. Lee | C.P. Wong
    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
    10/2006
    Springer
    9780387279749 (ISBN)
    Book
    Hardback
    Other editions
    €534.99
    Exhausted; check different version