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Your search for Paul S. Ho

  1. Cover: Advanced Interconnects for ULSI Technology - Wiley
    Mikhail Baklanov | Paul S. Ho | Ehrenfried Zschech
    Advanced Interconnects for ULSI Technology
    02/2012
    Wiley
    9781119963240 (ISBN)
    E-Book
    PDF
    Other editions
    €153.99
    Available for download
  2. Cover: Advanced Interconnects for ULSI Technology - Wiley
    Mikhail Baklanov | Paul S. Ho | Ehrenfried Zschech
    Advanced Interconnects for ULSI Technology
    02/2012
    Wiley
    9781119966869 (ISBN)
    E-Book
    ePUB
    Other editions
    €153.99
    Available for download
  3. This image is currently not available.
    Paul S. Ho | Chao-Kun Hu | Martin Gall
    Electromigration in Metals
    Fundamentals to Nano-Interconnects
    05/2022
    Cambridge University Press
    9781009287791 (ISBN)
    E-Book
    PDF
    Other editions
    €78.99
    Available for download
  4. Cover: Low Dielectric Constant Materials for IC Applications - Springer
    Paul S. Ho | Jihperng Leu | Wei William Lee
    Low Dielectric Constant Materials for IC Applications
    10/2012
    Springer
    9783642632211 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €160.49
    Shipment within 7-9 days
  5. Cover: Electromigration in Metals - Cambridge University Press
    Paul S. Ho | Chao-Kun Hu | Martin Gall
    Electromigration in Metals
    Fundamentals to Nano-Interconnects
    05/2022
    Cambridge University Press
    9781107032385 (ISBN)
    Book
    Hardback
    Other editions
    €102.50
    Shipment within 15-20 days
  6. Cover: Advanced Interconnects for ULSI Technology - Wiley
    Mikhail Baklanov | Paul S. Ho | Ehrenfried Zschech
    Advanced Interconnects for ULSI Technology
    03/2012
    Wiley
    9780470662540 (ISBN)
    Book
    Hardback
    Other editions
    €227.50
    Article not available at the moment
  7. Cover: Electronic Packaging Materials Science V: Volume 203 - Cambridge University Press
    Edwin D. Lillie | Paul S. Ho | Ralph Jaccodine
    Electronic Packaging Materials Science V: Volume 203
    Volume 203
    06/2014
    Cambridge University Press
    9781107409996 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €28.46
    Exhausted; check different version
  8. Cover: Materials Reliability Issues in Microelectronics: Volume 225 - Cambridge University Press
    James R. Lloyd | Frederick G. Yost | Paul S. Ho
    Materials Reliability Issues in Microelectronics: Volume 225
    06/2014
    Cambridge University Press
    9781107409873 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €28.46
    Exhausted; check different version
  9. Cover: Materials Reliability in Microelectronics III: Volume 309 - Cambridge University Press
    Kenneth P. Rodbell | William F. Filter | Harold J. Frost
    Materials Reliability in Microelectronics III: Volume 309
    Volume 309
    06/2014
    Cambridge University Press
    9781107409484 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €41.20
    Shipment within 15-20 days
  10. Cover: Silicon Materials-Processing, Characterization and Reliability: Volume 716 - Cambridge University Press
    Janice L. Veteran | David L. O'Meara | Veena Misra
    Silicon Materials-Processing, Characterization and Reliability: Volume 716
    06/2014
    Cambridge University Press
    9781107411937 (ISBN)
    Book
    Paperback/Softback
    €28.46
    Article not available
  11. Cover: Low Dielectric Constant Materials for IC Applications - Springer
    Paul S. Ho | Jihperng Leu | Wei William Lee
    Low Dielectric Constant Materials for IC Applications
    11/2002
    Springer
    9783540678199 (ISBN)
    Book
    Hardback
    Other editions
    €160.49
    Shipment within 10-15 days
  12. Cover: Stress-Induced Phenomena in Metallization - American Institute of Physics
    Ehrenfried Zschech | Shinichi Ogawa | Paul S. Ho
    Stress-Induced Phenomena in Metallization
    11th International Workshop
    12/2010
    1st EDN1st Edition
    American Institute of Physics
    9780735408555 (ISBN)
    Book
    Hardback
    €139.05
    No shipping information available
  13. Cover: Stress-Induced Phenomena in Metallization - American Institute of Physics
    Paul S. Ho | Ehrenfried Zschech | Shinichi Ogawa
    Stress-Induced Phenomena in Metallization
    Tenth International Workshop on Stress-Induced Phenomena in Metallization
    07/2009
    1st EDN1st Edition
    American Institute of Physics
    9780735406803 (ISBN)
    Book
    Hardback
    €110.37
    No shipping information available
  14. Cover: Materials Reliability in Microelectronics III: Volume 309 - Materials Research Society
    Kenneth P. Rodbell | William F. Filter | Harold J. Frost
    Materials Reliability in Microelectronics III: Volume 309
    08/1993
    Materials Research Society
    9781558992054 (ISBN)
    Book
    Hardback
    Other editions
    €53.41
    Exhausted; check for reprint
    New edition available
  15. Cover: Stress-Induced Phenomena in Metallization - American Institute of Physics
    Paul S. Ho | John Bravman | Che-Yu Li
    Stress-Induced Phenomena in Metallization
    Third International Workshop
    01/1998
    1st EDN1st Edition
    American Institute of Physics
    9781563964398 (ISBN)
    Book
    Hardback
    €223.63
    No shipping information available
  16. Cover: Stress induced Phenomena in Metallization: Fifth International Workshop - American Institute of Physics
    Oliver Kraft | Eduard Arzt | Cynthia A. Volkert
    Stress induced Phenomena in Metallization: Fifth International Workshop
    Stuttgart, Germany, June 23-25, 1999
    12/1999
    1st EDN1st Edition
    American Institute of Physics
    9781563969041 (ISBN)
    Book
    Hardback
    €67.36
    No shipping information available
  17. Cover: Electronic Packaging Materials Science V: Volume 203 - Materials Research Society
    Edwin D. Lillie | Paul S. Ho | Ralph Jaccodine
    Electronic Packaging Materials Science V: Volume 203
    06/1991
    Materials Research Society
    9781558990951 (ISBN)
    Book
    Hardback
    Other editions
    €57.13
    Exhausted; check different version
  18. Cover: Materials Reliability Issues in Microelectronics: Volume 225 - Materials Research Society
    James R. Lloyd | Frederick G. Yost | Paul S. Ho
    Materials Reliability Issues in Microelectronics: Volume 225
    10/1991
    Materials Research Society
    9781558991194 (ISBN)
    Book
    Hardback
    Other editions
    €58.37
    Exhausted; check different version
  19. Cover: Electronic Packaging Materials Science IX: Volume 445 - Materials Research Society
    Steven K. Groothuis | Paul S. Ho | Kenzo Ishida
    Electronic Packaging Materials Science IX: Volume 445
    10/1997
    Materials Research Society
    9781558993495 (ISBN)
    Book
    Hardback
    €48.46
    Exhausted, reprint undefined
  20. Cover: Silicon Materials-Processing, Characterization and Reliability: Volume 716 - Materials Research Society
    Janice L. Veteran | David L. O'Meara | Veena Misra
    Silicon Materials-Processing, Characterization and Reliability: Volume 716
    10/2002
    Materials Research Society
    9781558996526 (ISBN)
    Book
    Hardback
    €53.41
    Article not available
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