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Your search for Kazuo Kondo

  1. Cover: Three-Dimensional Integration of Semiconductors - Springer
    Kazuo Kondo | Morihiro Kada | Kenji Takahashi
    Three-Dimensional Integration of Semiconductors
    Processing, Materials, and Applications
    12/2015
    Springer
    9783319186757 (ISBN)
    E-Book
    PDF
    Other editions
    €96.29
    Available for download
  2. Cover: Copper Electrodeposition for Nanofabrication of Electronics Devices - Springer
    Kazuo Kondo | Rohan N. Akolkar | Dale P. Barkey
    Copper Electrodeposition for Nanofabrication of Electronics Devices
    11/2013
    1st EDN1st Edition
    Springer
    9781461491767 (ISBN)
    E-Book
    PDF
    Other editions
    €85.59
    Available for download
  3. Cover: Three-Dimensional Integration of Semiconductors - Springer
    Kazuo Kondo | Morihiro Kada | Kenji Takahashi
    Three-Dimensional Integration of Semiconductors
    Processing, Materials, and Applications
    03/2019
    Springer
    9783319792552 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €160.49
    Shipment within 10-15 days
  4. Cover: Three-Dimensional Integration of Semiconductors - Springer
    Kazuo Kondo | Morihiro Kada | Kenji Takahashi
    Three-Dimensional Integration of Semiconductors
    Processing, Materials, and Applications
    12/2015
    Springer
    9783319186740 (ISBN)
    Book
    Hardback
    Other editions
    €106.99
    Shipment within 10-15 days
  5. Cover: Copper Electrodeposition for Nanofabrication of Electronics Devices - Springer
    Kazuo Kondo | Rohan N. Akolkar | Dale P. Barkey
    Copper Electrodeposition for Nanofabrication of Electronics Devices
    08/2016
    Springer
    9781493953738 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €85.59
    Shipment within 15-20 days
  6. Cover: Copper Electrodeposition for Nanofabrication of Electronics Devices - Springer
    Kazuo Kondo | Rohan N. Akolkar | Dale P. Barkey
    Copper Electrodeposition for Nanofabrication of Electronics Devices
    11/2013
    Springer
    9781461491750 (ISBN)
    Book
    Hardback
    Other editions
    €106.99
    Shipment within 15-20 days
  7. Cover: Cuprous is key to acceleration in Copper bottom up filling - LAP Lambert Academic Publishing
    Kazuo Kondo
    Cuprous is key to acceleration in Copper bottom up filling
    08/2017
    LAP Lambert Academic Publishing
    9786202006347 (ISBN)
    Book
    Paperback/Softback
    €21.90
    Article not available for order