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Your search for John H. Lau

  1. Cover: Heterogeneous Integrations - Springer
    John H. Lau
    Heterogeneous Integrations
    04/2019
    1st EDN1st Edition
    Springer
    9789811372247 (ISBN)
    E-Book
    PDF
    Other editions
    €160.49
    Available for download
  2. Cover: Solder Joint Reliability - Springer
    John H. Lau
    Solder Joint Reliability
    Theory and Applications
    11/2013
    Springer
    9781461539100 (ISBN)
    E-Book
    PDF
    Other editions
    €213.99
    Available for download
  3. Cover: Fan-Out Wafer-Level Packaging - Springer
    John H. Lau
    Fan-Out Wafer-Level Packaging
    04/2018
    1st EDN1st Edition
    Springer
    9789811088841 (ISBN)
    E-Book
    PDF
    Other editions
    €106.99
    Available for download
  4. Cover: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology - Springer
    John H. Lau
    Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
    05/2024
    1st EDN1st Edition
    Springer
    9789819721405 (ISBN)
    E-Book
    PDF
    Other editions
    €181.89
    Available for download
  5. Cover: Chiplet Design and Heterogeneous Integration Packaging - Springer
    John H. Lau
    Chiplet Design and Heterogeneous Integration Packaging
    03/2023
    1st EDN1st Edition
    Springer
    9789811999178 (ISBN)
    E-Book
    PDF
    Other editions
    €139.09
    Available for download
  6. Cover: Semiconductor Advanced Packaging - Springer
    John H. Lau
    Semiconductor Advanced Packaging
    05/2021
    1st EDN1st Edition
    Springer
    9789811613760 (ISBN)
    E-Book
    PDF
    Other editions
    €128.39
    Available for download
  7. Cover: Assembly and Reliability of Lead-Free Solder Joints - Springer
    John H. Lau | Ning-Cheng Lee
    Assembly and Reliability of Lead-Free Solder Joints
    05/2020
    1st EDN1st Edition
    Springer
    9789811539206 (ISBN)
    E-Book
    PDF
    Other editions
    €117.69
    Available for download
  8. Cover: Solder Joint Reliability - Springer
    John H. Lau
    Solder Joint Reliability
    Theory and Applications
    02/2014
    Springer
    9781461367437 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €213.99
    Shipment within 5-7 days
  9. Cover: Heterogeneous Integrations - Springer
    John H. Lau
    Heterogeneous Integrations
    06/2019
    Springer
    9789811372261 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €133.42
    Exhausted; check different version
  10. Cover: Heterogeneous Integrations - Springer
    John H. Lau
    Heterogeneous Integrations
    04/2019
    Springer
    9789811372230 (ISBN)
    Book
    Hardback
    Other editions
    €171.19
    Shipment within 15-20 days
  11. Cover: Fan-Out Wafer-Level Packaging - Springer
    John H. Lau
    Fan-Out Wafer-Level Packaging
    12/2018
    Springer
    9789811342660 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €117.69
    Shipment within 15-20 days
  12. Cover: Fan-Out Wafer-Level Packaging - Springer
    John H. Lau
    Fan-Out Wafer-Level Packaging
    04/2018
    Springer
    9789811088834 (ISBN)
    Book
    Hardback
    Other editions
    €160.49
    Shipment within 15-20 days
  13. Cover: Chiplet Design and Heterogeneous Integration Packaging - Springer
    John H. Lau
    Chiplet Design and Heterogeneous Integration Packaging
    03/2024
    Springer
    9789811999192 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €139.09
    Shipment within 3-4 weeks
  14. Cover: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology - Springer
    John H. Lau
    Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
    05/2024
    Springer
    9789819721399 (ISBN)
    Book
    Hardback
    Other editions
    €181.89
    Shipment within 3-4 weeks
  15. Cover: Chiplet Design and Heterogeneous Integration Packaging - Springer
    John H. Lau
    Chiplet Design and Heterogeneous Integration Packaging
    03/2023
    Springer
    9789811999161 (ISBN)
    Book
    Hardback
    Other editions
    €192.59
    Shipment within 3-4 weeks
  16. Cover: Semiconductor Advanced Packaging - Springer
    John H. Lau
    Semiconductor Advanced Packaging
    05/2022
    Springer
    9789811613784 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €128.39
    Shipment within 3-4 weeks
  17. Cover: Assembly and Reliability of Lead-Free Solder Joints - Springer
    John H. Lau | Ning-Cheng Lee
    Assembly and Reliability of Lead-Free Solder Joints
    05/2021
    Springer
    9789811539220 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €123.04
    Shipment within 3-4 weeks
  18. Cover: Semiconductor Advanced Packaging - Springer
    John H. Lau
    Semiconductor Advanced Packaging
    05/2021
    Springer
    9789811613753 (ISBN)
    Book
    Hardback
    Other editions
    €171.19
    Shipment within 3-4 weeks
  19. Cover: Assembly and Reliability of Lead-Free Solder Joints - Springer
    John H. Lau | Ning-Cheng Lee
    Assembly and Reliability of Lead-Free Solder Joints
    05/2020
    Springer
    9789811539190 (ISBN)
    Book
    Hardback
    Other editions
    €171.19
    Shipment within 3-4 weeks
  20. This image is currently not available.
    John H. Lau
    Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
    02/2000
    McGraw-Hill Inc.,US
    9780071351416 (ISBN)
    Book
    Hardback
    €66.95
    Exhausted, reprint undefined
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