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Your search for Ibrahim (Abe) M. Elfadel

  1. Cover: Secure, Low-Power IoT Communication Using Edge-Coded Signaling - Springer
    Shahzad Muzaffar | Ibrahim (Abe) M. Elfadel
    Secure, Low-Power IoT Communication Using Edge-Coded Signaling
    05/2022
    1st EDN1st Edition
    Springer
    9783030959142 (ISBN)
    E-Book
    PDF
    Other editions
    €90.94
    Available for download
  2. Cover: VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence - Springer
    Ibrahim (Abe) M. Elfadel | Lutfi Albasha
    VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
    31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023, Revised Extended Selected Papers
    12/2024
    Springer
    9783031709470 (ISBN)
    E-Book
    PDF
    Other editions
    €90.94
    Available for download
  3. Cover: The IoT Physical Layer - Springer
    Ibrahim (Abe) M. Elfadel | Mohammed Ismail
    The IoT Physical Layer
    Design and Implementation
    09/2018
    1st EDN1st Edition
    Springer
    9783319931005 (ISBN)
    E-Book
    PDF
    Other editions
    €96.29
    Available for download
  4. Cover: 3D Stacked Chips - Springer
    Ibrahim (Abe) M. Elfadel | Gerhard Fettweis
    3D Stacked Chips
    From Emerging Processes to Heterogeneous Systems
    05/2016
    Springer
    9783319204819 (ISBN)
    E-Book
    PDF
    Other editions
    €53.49
    Available for download
  5. Cover: Machine Learning in VLSI Computer-Aided Design - Springer
    Ibrahim (Abe) M. Elfadel | Duane S. Boning | Xin Li
    Machine Learning in VLSI Computer-Aided Design
    03/2019
    1st EDN1st Edition
    Springer
    9783030046668 (ISBN)
    E-Book
    PDF
    Other editions
    €203.29
    Available for download
  6. Cover: VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things - Springer
    Michail Maniatakos | Ibrahim (Abe) M. Elfadel | Matteo Sonza Reorda
    VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
    25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
    05/2019
    Springer
    9783030156633 (ISBN)
    E-Book
    PDF
    Other editions
    €58.84
    Available for download
  7. Cover: Secure, Low-Power IoT Communication Using Edge-Coded Signaling - Springer
    Shahzad Muzaffar | Ibrahim (Abe) M. Elfadel
    Secure, Low-Power IoT Communication Using Edge-Coded Signaling
    05/2023
    Springer
    9783030959166 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €90.94
    Shipment within 7-9 days
  8. Cover: Secure, Low-Power IoT Communication Using Edge-Coded Signaling - Springer
    Shahzad Muzaffar | Ibrahim (Abe) M. Elfadel
    Secure, Low-Power IoT Communication Using Edge-Coded Signaling
    05/2022
    Springer
    9783030959135 (ISBN)
    Book
    Hardback
    Other editions
    €90.94
    Shipment within 7-9 days
  9. Cover: VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things - Springer
    Michail Maniatakos | Ibrahim (Abe) M. Elfadel | Matteo Sonza Reorda
    VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
    25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
    08/2020
    Springer
    9783030156657 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €58.84
    Shipment within 7-9 days
  10. Cover: Machine Learning in VLSI Computer-Aided Design - Springer
    Ibrahim (Abe) M. Elfadel | Duane S. Boning | Xin Li
    Machine Learning in VLSI Computer-Aided Design
    03/2019
    Springer
    9783030046651 (ISBN)
    Book
    Hardback
    Other editions
    €213.99
    Shipment within 7-9 days
  11. Cover: The IoT Physical Layer - Springer
    Ibrahim (Abe) M. Elfadel | Mohammed Ismail
    The IoT Physical Layer
    Design and Implementation
    01/2019
    Springer
    9783030065881 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €139.09
    Shipment within 7-9 days
  12. Cover: VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things - Springer
    Michail Maniatakos | Ibrahim (Abe) M. Elfadel | Matteo Sonza Reorda
    VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
    25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
    05/2019
    Springer
    9783030156626 (ISBN)
    Book
    Hardback
    Other editions
    €83.46
    Shipment within 7-9 days
  13. Cover: The IoT Physical Layer - Springer
    Ibrahim (Abe) M. Elfadel | Mohammed Ismail
    The IoT Physical Layer
    Design and Implementation
    09/2018
    Springer
    9783319930992 (ISBN)
    Book
    Hardback
    Other editions
    €106.99
    Shipment within 10-15 days
  14. Cover: 3D Stacked Chips - Springer
    Ibrahim (Abe) M. Elfadel | Gerhard Fettweis
    3D Stacked Chips
    From Emerging Processes to Heterogeneous Systems
    05/2018
    Springer
    9783319793054 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €53.49
    Shipment within 10-15 days
  15. Cover: Tapered Beams in MEMS - Springer
    Wajih U. Syed | Ibrahim (Abe) M. Elfadel
    Tapered Beams in MEMS
    A Symbolic Modeling Framework with Applications to Energy Harvesting
    10/2024
    Springer
    9783031663901 (ISBN)
    Book
    Hardback
    Other editions
    €90.94
    Shipment within 15-20 days
  16. Cover: VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence - Springer
    Ibrahim (Abe) M. Elfadel | Lutfi Albasha
    VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
    31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023, Revised Extended Selected Papers
    12/2024
    Springer
    9783031709463 (ISBN)
    Book
    Hardback
    Other editions
    €90.94
    Shipment within 15-20 days
  17. Cover: 3D Stacked Chips - Springer
    Ibrahim (Abe) M. Elfadel | Gerhard Fettweis
    3D Stacked Chips
    From Emerging Processes to Heterogeneous Systems
    05/2016
    Springer
    9783319204802 (ISBN)
    Book
    Hardback
    Other editions
    €53.49
    Shipment within 10-15 days