Your search for Hideki Aoyama

Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.The 114 papers are grouped as follows:Chapter 1: GrindingChapter 2: Abrasive Jet MachiningChapter 3: Advanced Cutting TechnologyChapter 4: Processing of Brittle MaterialsChapter 5: Chemical Mechanical Polishing, Processing of Semiconductor WaferChapter 6: Electrical Discharge Machining, Ultrasonic and Beam MachiningChapter 7: Finishing, Lapping and PolishingChapter 8: Surface and Subsurface Integrity and Materials CharacterizationChapter 9: In-Process Measurement and Monitoring, MetrologyChapter 10: Machine Tools and Systems, Tooling Processing

Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.The 114 papers are grouped as follows:Chapter 1: GrindingChapter 2: Abrasive Jet MachiningChapter 3: Advanced Cutting TechnologyChapter 4: Processing of Brittle MaterialsChapter 5: Chemical Mechanical Polishing, Processing of Semiconductor WaferChapter 6: Electrical Discharge Machining, Ultrasonic and Beam MachiningChapter 7: Finishing, Lapping and PolishingChapter 8: Surface and Subsurface Integrity and Materials CharacterizationChapter 9: In-Process Measurement and Monitoring, MetrologyChapter 10: Machine Tools and Systems, Tooling Processing

Selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA

Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.The 114 papers are grouped as follows:Chapter 1: GrindingChapter 2: Abrasive Jet MachiningChapter 3: Advanced Cutting TechnologyChapter 4: Processing of Brittle MaterialsChapter 5: Chemical Mechanical Polishing, Processing of Semiconductor WaferChapter 6: Electrical Discharge Machining, Ultrasonic and Beam MachiningChapter 7: Finishing, Lapping and PolishingChapter 8: Surface and Subsurface Integrity and Materials CharacterizationChapter 9: In-Process Measurement and Monitoring, MetrologyChapter 10: Machine Tools and Systems, Tooling Processing