Reliability Technology for Integrated Circuit Packaging
Description
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
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Content
Overview of Integrated Circuit Packaging Technology and Reliability.- Physical Properties and Reliability Characteristics of Integrated Circuit Packaging.- Failure Modes, Mechanisms, and Reliability of Plastic Packaging.- Failure Modes, Failure Mechanism and Reliability of Hermetic Packaging.- Failure Modes, Mechanisms, and Reliability of 3D Packaging.- Thermal Performance and Analysis Techniques of Integrated Circuit Packaging.- Mechanical Characteristics and Tests of Integrated Circuit Packaging.- Failure Analysis Techniques for Integrated Circuit Packaging.- Quality and Reliability Assurance in Integrated Circuit Packaging- Reliability of Integrated Circuit Board-level Assembly.
