Systems, Software and Services Process Improvement
29th European Conference, EuroSPI 2022, Salzburg, Austria, August 31 - September 2, 2022, Proceedings
Published on 25. August 2022
XXV, 825 pages
978-3-031-15559-8 (ISBN)
Description
This volume constitutes the refereed proceedings of the 29th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2022, held in Salzburg, Austria, in August-September 2022.
The 49 full papers and 8 short papers presented were carefully reviewed and selected from 110 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; SPI and team skills and diversity; SPI and recent innovations; virtual reality and augmented reality.
More details
Series
Language
English
Place of publication
Cham
Switzerland
Publishing group
Springer International Publishing
Target group
Professional and scholarly
Product notice
Reflowable
Illustrations
XXV, 825 p. 297 illus., 224 illus. in color.
File size
80,05 MB
ISBN-13
978-3-031-15559-8 (9783031155598)
DOI
10.1007/978-3-031-15559-8
Schweitzer Classification
Other editions
Additional editions
Murat Yilmaz | Paul Clarke | Richard Messnarz
Systems, Software and Services Process Improvement
29th European Conference, EuroSPI 2022, Salzburg, Austria, August 31 - September 2, 2022, Proceedings
Book
08/2022
Springer
€139.09
Shipment within 15-20 days
Content
SPI and Emerging and Multidisciplinary Approaches to Software Engineering.- Digitalisation of Industry, Infrastructure and E-Mobility.- SPI and Good/Bad SPI Practices in Improvement.- SPI and Functional Safety and Cybersecurity.- SPI and Agile.- SPI and Standards and Safety and Security Norms.- SPI and Team Skills and Diversity.- SPI and Recent Innovations.- Virtual Reality and Augmented Reality.
