Cloud-Based Cyber-Physical Systems in Manufacturing
Description
This book presents state-of-the-art research, challenges and solutions in the area of cloud-based cyber-physical systems (CPS) used in manufacturing. It provides a comprehensive review of the literature and an in-depth treatment of novel methodologies, algorithms and systems in the area of architecture design, cyber security, process planning, monitoring and control.
The book features detailed descriptions of how to derive solutions in a cloud environment where physical machines can be supported by cyber decision systems when engaged in real operations. It presents a range of novel ideas and is characterized by a balanced approach in terms of scope vs. depth and theory vs. applications. It also takes into account the need to present intellectual challenges while appealing to a broad readership, including academic researchers, practicing engineers and managers, and graduate students.
Dedicated to the topic of cloud-based CPS and its practical applications in manufacturing, this book benefits readers from all manufacturing sectors, from system design to lifecycle engineering and from process planning to machine control. It also helps readers to understand the present challenges and future research directions towards factories of the future, helping them to position themselves strategically for career development.
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Professor Lihui Wang is currently Chair of Sustainable Manufacturing at the KTH Royal Institute of Technology, Sweden. Contributing to cutting-edge academic research, highly qualified personnel training, technologies transfer to industries, and the advancement of engineering science and manufacturing, Professor Lihui Wang holds a PhD in Intelligence Science from Kobe University, Kobe, Japan, and has been the recipient of numerous awards including the 'Best Paper Award' at the International Conference on FAIM, Dresden, Germany, July 2002 and the Best Organiser of Symposium and Sessions (BOSS) Award at the ASME Manufacturing Science and Engineering Conference, Detroit, USA, June 2014, amongst others.
He is currently Editor-in-Chief of the International Journal of Manufacturing Research and Editor for the Journal of Intelligent Manufacturing, Robotics and Computer-Integrated Manufacturing, and an Editorial Board Member of the Chinese Journal of Mechanical Engineering and the International Journal of Computer Integrated Manufacturing, amongst others.Professor Lihui Wang has published over 130 refereed journal papers and is author of more than 7 books and 15 book chapters. He is also an associate member of the International Academy for Production Engineering (CIRP).
Xi Vincent Wang is currently a Postdoctoral Research fellow in Production Systems, Cloud Manufacturing and Robotics/Cyber Physical Systems at the KTH Royal Institute of Technology, Sweden.
He is Managing Editor of the International Journal of Manufacturing Research and serves as Project Manager of the EU SYMBIO-TIC project.
Holding a PhD in Mechanical Engineering from the University of Auckland and a Bachelor of Engineering from Tianjin University, Xi Vincent Wang has published numerous journal articles and book chapters.
Content
1. Literature Survey and Trends.- 2. Current Status and Recent Development in Cloud Technologies.- 3.Advances in Cyber-Physical Systems.- 4.Challenges in Cyber Security and Solutions.- 5Sensor-Driven Machine Availability and Capability Monitoring in Distributed Environment.- 6.Cloud-Enabled Adaptive and Collaborative Process Planning Based on Real-Time Machine Availability.- 7.Process-Embedded Function Blocks for Adaptive Machining in Cyber-Physical Environment.- 8.Fleet-wide Condition Monitoring for Predictive Maintenance Using Cyber Prognostic Techniques.- 9Energy Map and Resource Efficiency Calculation as a Cloud Service.- 10.Human Safety and Cyber Security in Remote Robotic Assembly.- 11.Cloud Robotics towards Development of a Cyber-Physical Assembly System.- 12.-Symbiotic Human-Robot Collaborative Assembly with Embedded Sensing and Decision Support.- 13.CPS Systems Design and Lifecycle Analysis.
