Design Guidelines for Surface Mount Technology
Published on 2. December 2012
326 pages
978-0-323-14165-9 (ISBN)
Description
Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.
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John Traister
Design Guidelines for Surface Mount Technology
Book
03/1990
Academic Press
€54.55
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Content
Preface Chapter 1 SMD Essentials Designing with SMD Substrate Configurations Mixed Prints Automated SMD Placement Machines Soldering Techniques Footprint Definition Footprints for Wave Soldering The "Shadow Effect" Footprint Orientation Solder Thieves Placement Inaccuracy Dummy Tracks for Adhesive Application Footprints for Reflow Soldering Solder Cream Applications Screen Printing Floating Footprint Dimensions Layout Considerations Component Pitch Solder Land/Via Hole Relationship Solder Land/Component Lead Relationship Placemant Machine Restrictions Substrate Population Test Points CAD Systems for SMD Substrate Layout CAE/CAD/CAM Interaction Chapter 2 Space Planning and Interface Standards for SMT Components Component Packaging Options Component Selection Guidelines Passive Devices: Monolithic Capacitors Tantalum Capacitors Resistors for SMT Resistor Networks Potentiometer for SMT Active Devices ICs for SMT Small Outline (SO) ICs Plastic Chip Carriers and Quad Packages Ceramic ICs Connectors and Interface for SMT Assembly Heat Seal Compression Assembly Considerations Estimating Total Component Area Optimizing Component Placement Component Orientation Utilizing Both Sides of Substrate Thermal Considerations Power Dissipation Thermal Resistance Junction Temperature (Tj) Factors Affecting ¿JA Package Considerations Thermal Resistance Measurements Test Method TSP Calibration Thermal Resistance Measurement Test Ambient ¿JC Tests Data Presentation Thermal Calculations System Considerations Using Leaded Devices (SO, SOL, & PLCC) Compliant Layer Matching TCE Substrate Types Conclusion Chapter 3 Specifying Materials for Substrates Common Substrate Materials Fabrication and Material Planning Providing for Assembly Automation Design Rules and Layout Guidelines Plated through-Holes Multilayer and Fine Line Construction Surface Mount and Via Holes Computer Aided Design and Via Holes Solder Mask on PC Boards Using SMT Plating Process for SMT High Tech Materials for Military Applications Specifying Copper Clad Invar Materials for Copper Clad Invar/Polyamide Commercial SMD Packages Military Packages Special Package Outlines Bar Code Labeling Footprints Chapter 4 SMD Assembly Process Solders for SMD Applications Fluxing and Cleaning Types of Flux Flux Types Solder Applications Curing Solder Paste The Reflow Process Cleaning after Reflow Soldering Assembly Methods Assembly Options for SMDs Adhesive Applications and Curing Physical Characteristics Adhesive Application Pin-Transfer Screen-Printing Pressure Syringe Adhesive Dot Height Criteria Dummy Tracks Solder Land Contamination MELF Component Placement Adhesive Curing Curing by Heat/Time Plus Catalyst Curing by Catalytic Action Alone Anaerobic and UV Assisted Curing Fluxing and Cleaning Fluxes Types of Flux Organic Soluble Fluxes Non-Activated Rosin (R) Flux Rosin, Mildly Activated (RMS) Flux Rosin, Activated (RA) Flux Water Soluble Fluxes Water Soluble Fluxes with Inorganic Salts Water Soluble Fluxes with Organic Salts Water Soluble Fluxes with Organic Acids Solder Creams Flux Selection Application of Flux Foam Fluxing Wave Fluxing Spray Fluxing Flux Density Pre-Heating Post-Soldering Cleaning Polar Contaminants Non-Polar Contaminants Solvents Solvent Cleaning Aqueous Cleaning Conformal Coatings Conclusions Solder Joint
