
Physical Design for 3D Integrated Circuits
Description
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The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:
Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
Supplies state-of-the-art solutions for challenges unique to 3D circuit design
Features contributions from renowned experts in their respective fields
Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
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Persons
Chuan Seng Tan holds a BEng in electrical engineering from the University of Malaya, Malaysia; an MEng in advanced materials from the National University of Singapore; and a PhD in electrical engineering from the Massachusetts Institute of Technology, Cambridge. He has been a research engineer with the Institute of Microelectronics, Singapore; an Applied Materials Graduate Fellow; and an intern at Intel Corporation, Oregon. He is currently an associate professor at Nanyang Technological University, Singapore, where he previously served as a Lee Kuan Yew Postdoctoral Fellow and an inaugural Nanyang Assistant Professor. Widely published, Dr. Tan participates in several international conference committees and is a member of the IEEE. He has edited three and co-authored two books, and serves as an associate editor for Elsevier Microelectronics Journal.
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