Microwave Circuit Modeling Using Electromagnetic Field Simulation
1st Edition
Published on 1. January 2002
496 pages
978-1-58053-688-2 (ISBN)
Description
This unique "e;how to"e; book is an ideal introduction to electromagnetic field-solvers. It provides you with helpful advice on selecting the right tools for your RF and high-speed digital circuit design work. The focus is on the strengths and weaknesses of the major commercial software packages. . Featuring full-color illustrations, this practical resource offers you invaluable tips and techniques on the use and evaluation of these products. A generous amount of case study material is presented, including a 'what went wrong in the design process' discussion, when applicable. Color plots of current density and various field quantities included throughout the book help you better understand the fundamental behavior of the circuits being studied. Stress is given to the impact of meshing, geometrical resolution and convergence on the solution process, showing you that you can better control and greatly influence the quality and speed of the solution. You'll appreciate solving problems using the fundamental, underlying physics, rather than the more approximate methods used in the past. Specific design information on transitions in multilayer PCBs and PCB connectors is not available in any other book.
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Daniel G. Swanson Jr | Wolfgang J.R. Hoefer
Microwave Circuit Modeling Using Electromagnetic Field Simulation
Book
07/2003
Artech House Publishers
€129.24
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Content
- Intro
- Contents vii
- C1 Introduction 1
- 1.1 General Field-Solver Applications 2
- 1.2 A Note on Color Plots 3
- 1.3 A Note on 3D Wireframe Views 4
- 1.4 A Brief Historical View 6
- C2 CAD of Passive Components 9
- 2.1 Circuit-Theory-Based CAD 10
- 2.2 Field-Theory-Based CAD
- 2.3 Solution Time for Circuit Theory and Field Theory 16
- 2.4 A "Hybrid" Approach to Circuit Analysis 18
- 2.5 Optimization 23
- 2.6 Modern Microwave CAD-What's Missing? 24
- 2.7 The Next Decade 26
- C3 Numerical Electromagnetics 29
- 3.1 Microwave Analysis and Design 30
- 3.2 Methods of Electromagnetic Analysis 32
- 3.3 The Features Common to All Numerical Methods 34
- 3.4 The Differences Between Numerical Methods 35
- 3.5 Categories of Numerical Methods 35
- 3.6 Expansion Functions 37
- 3.7 Strategies for Finding the Unknown Coefficients 40
- 3.8 The Method of Moments 43
- 3.9 The Finite Element Method 50
- 3.10 Finite Difference and Finite Integration Methods 55
- 3.11 Finite Difference Time Domain Formulations 61
- 3.12 Transmission Line Matrix Methods 67
- 3.13 Output from Electromagnetic Simulators 73
- 3.14 Discussion and Conclusion 75
- 3.15 Further Reading 77
- C4 Alternative Classifications 81
- 4.1 Classification by Geometry 81
- 4.2 Classification by Solution Domain 85
- C5 Moment Method Simulators 89
- 5.1 Closed Box Moment Method-Strengths 89
- 5.2 Closed Box Moment Method-Weaknesses 89
- 5.3 Laterally Open Moment Method-Strengths 90
- 5.4 Laterally Open Moment Method-Weaknesses 90
- 5.5 Issues Common to Both MOM Formulations 91
- 5.6 Exceptions to General MOM Comments 92
- 5.7 50-OHM Microstripline 92
- 5.8 MOM-Cells and Subsections 95
- 5.9 MOM-Validation Structures 96
- 5.10 MOM Meshing and Convergence 98
- 5.11 Controlling Meshing 102
- 5.12 MOM-Displaying Voltage 114
- 5.13 MOM-Calibration Structures 116
- 5.14 Visualization 122
- C6 Finite Element Method Simulators 125
- 6.1 Finite Element Method-Strengths 125
- 6.2 Finite element Method-Weaknesses 127
- 6.3 FEM Simulators-Validation Structures 128
- 6.4 Controlling Meshing 128
- 6.5 FEM Calibration Structures 145
- 6.6 Visualization 150
- C7 FDTD and TLM Simulators 153
- 7.1 FDTD and TLM-Strengths 153
- 7.2 FDTD and TLM-Weaknesses 154
- 7.3 FDTD and TLM-Validation Structures 156
- 7.4 Controlling Meshing 163
- 7.5 Visualization 170
- C8 Ports and De-embedding 173
- 8.1 Ports-Connecting Fileds to Circuits 173
- 8.2 De-Embedding and Unterminating 176
- 8.3 Closed Box MOM Ports and De-Embedding 180
- 8.4 Laterally Open MOM Ports and De-Embedding 183
- 8.5 3D FEM Ports and De-Embedding 184
- 8.6 3D FDTD and TLM Ports and De-Embedding 187
- 8.7 Internal, Lumped, and Gap Ports 189
- 8.8 Symmetry and Ports 193
- C9 Numerical Methods Summary 199
- 9.1 Meshing 199
- 9.2 Convergence 200
- 9.3 Validation Structures 202
- 9.4 Calibration Structures 202
- 9.5 Ports and De-Embedding 203
- C10 Microstrip 205
- 10.1 Discontinuities 205
- 10.2 Microstrip Vias and Slots 207
- 10.3 Microstrip 3D Vias 209
- 10.4 Modeling Microstrip Vias 212
- 10.5 Microstrip Mitered Bend 215
- 10.6 Microstrip Tee-Junction 217
- 10.7 Summary for Microstrip Discontinuities 219
- 10.8 Quasi-TEM Nature of Microstrip 220
- 10.9 Evanescent Modes in Microstrip 222
- 10.10 Microstrip Loss 224
- 10.11 Compaction of Microstrip Circuits 229
- C11 Computing Impedance 237
- 11.1 Single Strip Impedance and Phase Velocity 237
- 11.2 Single Strip Impedance Using Symmetry 244
- 11.3 Coupled Line Parameters Using Symmetry 246
- 11.4 CPW with Dielectric Overlay 250
- 11.5 Buried Transmission Lines 252
- 11.6 Other Applications of 2D Cross-Section Solvers 253
- C12 Vias, Via Fences, and Grounding Pads 255
- 12.1 Vias in FR4 255
- 12.2 A More Advanced Via Model 258
- 12.3 Summary for Microstrip Single Layer Vias 262
- 12.4 Via Isolation Fences-Part I 263
- 12.5 Via Isolation Fences-Part II 268
- 12.6 Grounding Pads 271
- 12.7 Summary for Grounding Pads 281
- C13 Multilayer Printed Circuit Boards 283
- 13.1 A Multilayer Transition in FR4 283
- 13.2 Controlled Impedance Transitions 290
- 13.3 A 10-GHz Switch Matrix 305
- 13.4 Summary 311
- C14 Connectors 315
- 14.1 RF Edge-Launch Connectors 315
- 14.2 Digital Edge-Launch Connectors 321
- 14.2 Another Digital Edge-Launch Exampe 323
- 14.4 Through Hole SMA Connectors 326
- 14.5 Surface Mount SMA Connectors 333
- 14.6 Summary 336
- C15 Backward Wave Couplers 339
- 15.1 PCS Band CPW Coupler 339
- 15.2 Couplers and Metal Thickness 347
- 15.3 Lange Couplers 357
- 15.4 PCS Band 15-DB Coupler 363
- 15.5 PCS Band Coax-to-Coax Transition 369
- C16 Microstrip Filters 377
- 16.1 Interdigital Filters 378
- 16.2 EDGE-Coupled Filters 384
- 16.3 22.5-GHz Bandpass Filter 387
- 16.4 3.7-GHz Bandpass Filter 394
- 16.5 1.5 to 5.5-GHz Bandpass Filter 399
- 16.6 22.5-GHz Bandstop Filter 401
- C17 Other Microwave Filters 407
- 17.1 Coaxial Lowpass Filters 407
- 17.2 3.5-GHz Combline Filter 414
- 17.3 2.14-GHz Combine Filter 425
- C18 Choosing the Right Software 433
- 18.1 The Solution Process from Start to Finish 433
- 18.2 Features All Tools Must Have 434
- 18.3 Features That Are Nice to Have 435
- 18.4 Visualization 435
- 18.5 Ease of Use and Total Solution Time 436
- 18.6 The Right Tool for the Job 437
- Appendix A: Survey of Field-Solver Software 439
- A.1 2D Cross-Section-Solvers 439
- A.2 2.5D Planar Solvers (3D Mostly Planar) 445
- A.3 3D Arbitrary Geometry Solvers 449
- Appendix B: List of Software Vendors 453
- Appendix C: List of Internet Sites 457
- About the Authors 459
- Index 461
