Power Integrity Modeling and Design for Semiconductors and Systems
1st Edition
Published on 19. November 2007
496 pages
978-0-13-813821-9 (ISBN)
Description
This is the eBook version of the printed book. If the print book includes a CD-ROM, this content is not included within the eBook version.
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.
Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.
The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.
The authors
Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.
Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.
The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.
The authors
Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
More details
Edition
1. Auflage
Language
English
Place of publication
United States
Publishing group
Pearson Education (US)
Target group
Professional and scholarly
File size
18,69 MB
ISBN-13
978-0-13-813821-9 (9780138138219)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Madhavan Swaminathan | Ege Engin
Power Integrity Modeling and Design for Semiconductors and Systems
Book
12/2007
Prentice Hall
€118.83
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Persons
Madhavan Swaminathan received his B.E. in electronics and communication from Regional Engineering College, Tiruchirapalli, in 1985, and his M.S. and Ph.D. in electrical engineering from Syracuse University in 1989 and 1991. He is currently the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and deputy director of the Packaging Research Center, Georgia Tech. He is also the cofounder of Jacket Micro Devices, a company specializing in RF modules for wireless applications. Before joining Georgia Tech, he worked on packaging for supercomputers for IBM. Swaminathan has written more than 300 publications, holds 15 patents, and has been honored as an IEEE Fellow for his work on power delivery.
A. Ege Engin received his B.S. and M.S. in electrical engineering from Middle East Technical University, Ankara, Turkey, and from the University of Paderborn, Germany. From 2001 to 2004, he was with the Fraunhofer Institute for Reliability and Microintegration in Berlin. During this time, he also received his Ph.D. from the University of Hannover, Germany. He is currently a research engineer in the School of Electrical and Computer Engineering and an assistant research director of the Packaging Research Center at Georgia Tech. He has more than 50 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation.
A. Ege Engin received his B.S. and M.S. in electrical engineering from Middle East Technical University, Ankara, Turkey, and from the University of Paderborn, Germany. From 2001 to 2004, he was with the Fraunhofer Institute for Reliability and Microintegration in Berlin. During this time, he also received his Ph.D. from the University of Hannover, Germany. He is currently a research engineer in the School of Electrical and Computer Engineering and an assistant research director of the Packaging Research Center at Georgia Tech. He has more than 50 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation.
Content
Preface xiii
Acknowledgments xvii
About the Authors xxi Chapter 1: Basic Concepts 1
1.1 Introduction 1
1.2 Simple Relationships for Power Delivery 10
1.3 Design of PDNs 17
1.4 Components of a PDN 24
1.5 Analysis of PDNs 45
1.6 Chip-Package Antiresonance: An Example 61
1.7 High-Frequency Measurements 65
1.8 Signal Lines Referenced to Planes 71
1.9 PDN Modeling Methodology 77
1.10 Summary 79
Chapter 2: Modeling of Planes 83
2.1 Introduction 83
2.2 Behavior of Planes 84
2.3 Lumped Modeling Using Partial Inductances 89
2.4 Distributed Circuit-Based Approaches 94
2.5 Discretization-Based Plane Models 117
2.6 Analytical Methods 133
2.7 Multiple Plane Pairs 138
2.8 Summary 169
Chapter 3: Simultaneous Switching Noise 175
3.1 Introduction 175
3.2 Simple Models 177
3.3 Modeling of Transmission Lines and Planes 185
3.4 Application of Models in Time-Domain Analysis 209
3.5 Application of Models in Frequency-Domain Analysis 226
3.6 Extension of M-FDM to Incorporate Transmission Lines 233
3.7 Summary 239
Chapter 4: Time-Domain Simulation Methods 243
4.1 Introduction 243
4.2 Rational Function Method 244
4.3 Signal Flow Graphs 295
4.4 Modified Nodal Analysis (MNA) 317
4.5 Summary 327
Chapter 5: Applications 333
5.1 Introduction 333
5.2 High-Speed Servers 334
5.3 High-Speed Differential Signaling 349
5.4 Analysis of IC Packages 365
5.5 Extraction of Dielectric Constant and Loss Tangent 372
5.6 Embedded Decoupling Capacitors 392
5.7 Electromagnetic Bandgap (EBG) Structures 415
5.8 Future Challenges 443
Appendix A 451
A.1 Multiport Networks 451
A.2 Matrix Representation of Transmission Lines 453
A.3 Spectrum of Digital Signals 454
Appendix B: Software List 459 Index 461
Acknowledgments xvii
About the Authors xxi Chapter 1: Basic Concepts 1
1.1 Introduction 1
1.2 Simple Relationships for Power Delivery 10
1.3 Design of PDNs 17
1.4 Components of a PDN 24
1.5 Analysis of PDNs 45
1.6 Chip-Package Antiresonance: An Example 61
1.7 High-Frequency Measurements 65
1.8 Signal Lines Referenced to Planes 71
1.9 PDN Modeling Methodology 77
1.10 Summary 79
Chapter 2: Modeling of Planes 83
2.1 Introduction 83
2.2 Behavior of Planes 84
2.3 Lumped Modeling Using Partial Inductances 89
2.4 Distributed Circuit-Based Approaches 94
2.5 Discretization-Based Plane Models 117
2.6 Analytical Methods 133
2.7 Multiple Plane Pairs 138
2.8 Summary 169
Chapter 3: Simultaneous Switching Noise 175
3.1 Introduction 175
3.2 Simple Models 177
3.3 Modeling of Transmission Lines and Planes 185
3.4 Application of Models in Time-Domain Analysis 209
3.5 Application of Models in Frequency-Domain Analysis 226
3.6 Extension of M-FDM to Incorporate Transmission Lines 233
3.7 Summary 239
Chapter 4: Time-Domain Simulation Methods 243
4.1 Introduction 243
4.2 Rational Function Method 244
4.3 Signal Flow Graphs 295
4.4 Modified Nodal Analysis (MNA) 317
4.5 Summary 327
Chapter 5: Applications 333
5.1 Introduction 333
5.2 High-Speed Servers 334
5.3 High-Speed Differential Signaling 349
5.4 Analysis of IC Packages 365
5.5 Extraction of Dielectric Constant and Loss Tangent 372
5.6 Embedded Decoupling Capacitors 392
5.7 Electromagnetic Bandgap (EBG) Structures 415
5.8 Future Challenges 443
Appendix A 451
A.1 Multiport Networks 451
A.2 Matrix Representation of Transmission Lines 453
A.3 Spectrum of Digital Signals 454
Appendix B: Software List 459 Index 461
