
Transmit Receive Modules for Radar and Communication Systems
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Content
- Intro
- Contents
- Preface
- Acknowledgments
- 1 Phased Arrays
- 1.1 Phased Arrays in Radar and Communica
- 1.2 Antennas
- 1.3 Antenna Patterns and Line Arrays
- 1.4 Electronically Steerable Antennas
- 1.5 Radar Equation for Targets
- 1.6 Radar Equation for Weather
- 1.7 Phased Arrays for Communication Syst
- 1.8 Conclusions
- Problems
- References
- 2 Transmit/Receive Modules
- 2.1 Introduction to Transmit/Receive Mod
- 2.2 Early T/R Module Development Efforts
- 2.3 MMIC-Based T/R Modules
- 2.4 T/R Module Performance Requirements
- 2.5 T/R Module Components
- 2.5.1 Transmit/Receive Switches
- 2.5.2 Phase Shifter
- 2.5.3 Attenuators
- 2.5.4 Core Chip
- 2.5.5 Driver Amplifier
- 2.5.6 Power Amplifier
- 2.5.7 Circulator or Duplexer
- 2.5.8 Limiter or Receive Protect Circuit
- 2.5.9 Low-Noise Amplifier
- 2.6 Module Control and Power Conditionin
- 2.7 Conclusions
- Problems
- References
- 3 Semiconductors for T/R Modules
- 3.1 Introduction
- 3.2 Semiconductor Materials
- 3.2.1 GaAs
- 3.2.2 Heterostructures
- 3.2.3 SiC
- 3.2.4 GaN
- 3.2.5 InP
- 3.2.6 SiGe
- 3.3 RF Semiconductor Wafer Fabrication P
- 3.3.1 Isolation
- 3.3.2 Ohmic Contacts
- 3.3.3 Gate Formation
- 3.3.4 Dielectric Deposition
- 3.3.5 Electroplating
- 3.3.6 Air Bridges
- 3.4 Active Devices
- 3.4.1 GaAs MESFETs
- 3.4.2 GaAs PHEMTs
- 3.4.3 GaN HEMTs
- 3.5 MMICs
- 3.6 Conclusions
- Problems
- References
- 4 Signal Integrity Issues in T/R Modules
- 4.1 Introduction to Signal Integrity
- 4.2 Chip-Level Interconnects
- 4.2.1 Wire Bonding Methods
- 4.2.2 Wire Bond Modeling
- 4.2.3 Flip-Chip Methods
- 4.3 Package/Module-Level Interconnect
- 4.3.1 Module Interconnects
- 4.3.2 SMT Package Interconnects
- 4.4 Transmission Line Interconnects
- 4.5 Coupling Between Interconnects
- 4.6 Vertical Transition Interconnects
- 4.7 Module Resonances
- 4.8 Conclusions
- Problems
- References
- 5 Materials for T/R Modules
- 5.1 Introduction to Materials
- 5.2 Electrical Parameters and Their Meas
- 5.2.1 Dielectric Constant
- 5.2.2 Loss Tangent
- 5.2.3 Measurement of Dielectric Constant
- 5.2.4 Metal Electrical Conductivity
- 5.3 Mechanical Parameters
- 5.3.1 Thermal Conductivity
- 5.4 Ceramic Materials
- 5.4.1 Thin-Film Ceramic
- 5.4.2 Thick-Film Ceramic
- 5.4.3 Thermally Enhanced Thick-Film Proc
- 5.4.4 High-Temperature Co-Fired Ceramic
- 5.4.5 Low-Temperature Co-Fired Ceramic (
- 5.5 Laminate Packaging
- 5.5.1 Laminate Board Fabrication
- 5.5.2 High-Performance Laminate Material
- 5.5.3 Liquid Crystal Polymers
- 5.5.4 MCM-L Laminate Multichip Modules
- 5.6 Conclusions
- Problems
- References
- 6 Heat Issues and Solutions for T/R Module
- 6.1 Introduction to Thermal Issues and Solutions
- 6.2 Heat Flux in MMIC High-Power Amplifiiers
- 6.3 Amplifier Efficiency and Dissipated Thermal Power
- 6.4 Thermal Resistance and Device Junction Temperature
- 6.5 Example of Heat Dissipated by Componentss in a T/R Module
- 6.6 Reliability Calculations
- 6.7 Diamond-Enhanced GaN High-Power Amplifers for T/R Modules
- 6.8 Thermal Simulations Using SPICE
- 6.9 Thermal Measurements
- 6.9.1 Electrical Test Methods
- 6.9.2 Optical Methods
- 6.9.3 Temperature Measurements Using Liquid Crystal Thermography
- 6.9.4 Thermal Design Using Surrogate Validation Chips
- 6.10 Conclusions
- Problems
- References
- 7 MMIC Fabrication and T/R Module Manufact
- 7.1 Introduction
- 7.2 MMIC Fabrication
- 7.2.1 MMIC Facilities
- 7.2.2 MMIC Fabrication Processes
- 7.2.3 MMIC Foundry Procedures
- 7.3 T/R Module Manufacturing
- 7.3.1 T/R Module Manufacturing Facilities
- 7.3.2 T/R Module Manufacturing Processes
- 7.4 Conclusions
- Problems
- References
- 8 Testing of MMICs and T/R Modules
- 8.1 Introduction to Testing
- 8.2 MMIC Testing
- 8.2.1 Incoming Materials Testing
- 8.2.2 In-Process Testing
- 8.2.3 On-Wafer RF Testing
- 8.2.4 MMIC Screening Tests
- 8.2.5 MMIC Reliability Testing
- 8.3 T/R Module Specifications
- 8.4 T/R Module Testing
- 8.4.1 Key Electrical Parameters
- 8.4.2 Example of Key Parameter Requirements on an X-Band T/R Module
- 8.4.3 Automated Electrical Test Set
- 8.5 Conclusions
- Problems
- References
- 9 MMIC and T/R Module Cost
- 9.1 Introduction
- 9.2 MMIC Cost
- 9.2.1 MMIC Wafer Fabrication Cost
- 9.2.2 Wafer Fabrication Process Yield
- 9.2.3 Wafer Diameter Impact on MMIC Cost
- 9.2.4 Impact of MMIC Fabrication Facility Loading on Cost
- 9.2.5 MMIC Cost Based on Area or Output Power
- 9.3 T/R Module Cost
- 9.4 Cost Reduction
- 9.4.1 MMIC Cost Reduction
- 9.4.2 T/R Module Cost Reduction
- 9.5 Conclusions
- Problems
- References
- 10 Next-Generation T/R Modules
- 10.1 Introduction
- 10.2 Single-Chip T/R Module
- 10.3 Wafer-Scale Phased Array
- 10.4 Si-CMOS: The Lowest-Cost Single-Chip T/R
- 10.5 Digital Beamforming
- 10.6 Hybrid Digital/Analog Beam Forming
- 10.7 Switch Beam and Butler Matrix Phased Arrays
- 10.8 Highly Integrated Packaging of T/R Modules
- 10.9 Path to Low-Cost Systems: Open Architectures
- 10.10 Conclusions
- Problems
- References
- About the Authors
- Index
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