Speciality Polymers/Polymer Physics
Springer (Publisher)
Published on 21. January 2006
VII, 197 pages
978-3-540-46010-7 (ISBN)
Description
Das Buch enthält Kapitel über: N. Kinjo, M. Ogata, Ibaraki-ken; K. Nishi, Tokyo; A. Kaneda, Yokohama, Japan: Epoxyd-Formmassen als Einschlußmaterialien für mikroelektronische Geräte Yu.S. Lipatov, T.E. Lipatova, L.F. Kosyanchuk, Kiev, UdSSR: Synthese und Struktur struktureller Makromoleküle K. Horie, I. Mita, Tokyo, Japan: Reaktionen und Photodynamik in polymeren Festkörpern Yu.K. Godovsky, V.S. Papkov, Moskau, UdSSR: Thermotrope Mesophasen elementorganischer Polymere TOC:Contents: N. Kinjo, M. Ogata, Ibaraki-ken; K. Nishi, Tokyo; A. Kaneda, Yokohama, Japan: Epoxy Molding Compounds as Encapsulation Materials for Microelectronic DevicesYu.S. Lipatov, T.E. Lipatova, L.F. Kosyanchuk, Kiev, USSR: Synthesis and Structure of Macromolecular Topological CompoundsK. Horie, I. Mita, Tokyo, Japan: Reactions and Photodynamics in Polymer SolidsYu.K. Godovsky, V.S. Papkov, Moscow, USSR: Thermotropic Mesophases in Element-Organic Polymers
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02/1989
1st Edition
Springer
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Content
Epoxy molding compounds as encapsulation materials for microelectronic devices.- Synthesis and structure of macromolecular topological compounds.- Reactions and photodynamics in polymer solids.- Thermotropic mesophases in element-organic polymers.
