Resistor-Based Temperature Sensors in Deep-Submicron CMOS Technology
Description
This book discusses in detail the fundamental principles and design specifications governing fully-integrated temperature sensors in deep-submicron CMOS technology. It provides an in-depth analysis of diverse sensing and readout circuit architectures, cutting-edge ultra-low-voltage and frequency-locked loop (FLL) design methodologies, and detailed implementation strategies. Readers will gain valuable insights from the latest advancements in deep-submicron CMOS technology, mastering a range of precision-driven, area- and energy-efficient techniques. This knowledge empowers readers to identify and develop optimal architectures tailored to specific applications and technology nodes. Moreover, the book serves as an invaluable resource for professionals in circuit and system design, particularly those focused on temperature sensing systems or high-performance integrated circuits, offering practical guidance for researchers and engineers in both academia and industry.
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Dan Shi received the B.Sc. and M.Sc. degree in microelectronics from Sichuan University, Chengdu, China, in 2016 and 2019, respectively. And, she received the Ph.D. degree in electrical and computer engineering (ECE) at University of Macau, Macau, China in 2025. She served as an Associate Professor at Guangdong University of Technology since 2025. She worked as an analog circuits design engineer at IC company for two years from 2019 to 2021, where she was involved in high-speed clock, I/O interface, analog driven-circuit designs. Her current research focuses on the design of low-voltage and energy-efficient smart temperature sensors.
Dr. Shi has published prestigious IEEE journals and conferences, including International Solid-State Circuits Conference (ISSCC), Journal of Solid-State Circuits (JSSC), Transactions on Circuits and Systems I (TCAS-I), Transactions on Circuits and Systems II (TCAS-II), and International Conference on Integrated Circuits, Technologies and Applications (ICTA). She was a recipient of the student travel grant award (STGA) in 2025 ISSCC.
Rui P. Martins received the Ph.D. in Electrical Engineering and Computers from the Department of Electrical and Computer Engineering, Instituto Superior Técnico, University of Lisbon, Portugal, in 1992, and has been with that Department since October 1980. From 1992, he has been on leave from University of Lisbon and with the Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macao, China, where he is a Chair-Professor since Aug. 2013. His research interests are on analog and mixed-signal VLSI design and has authored or co-authored 900+ publications, including 10 books, 12 book chapters, 50 Patents, 300+ papers in scientific journals and 400+ in conference proceedings. He was the Founding Director of the State Key Laboratory of Analog and Mixed-Signal VLSI, between 2011 and 2022, and is currently the Director of the Institute of Microelectronics, both at the University of Macau, Macao, China.
Prof. Rui Martins is an IEEE Fellow, received an Author Recognition Award at the 70 years of ISSCC, in 2023, as a Top Contributor with more than 50 papers, and 3 Medals from Macao Government in 1999, 2001 and 2021. Since July 2010 he is an Academician with the Lisbon Academy of Sciences, Portugal.
Pui-In Mak received the Ph.D. degree from University of Macau (UM), Macao, China, in 2006. He is currently Professor at UM Faculty of Science and Technology - ECE Department, Director at the State Key Laboratory of Analog and Mixed-Signal VLSI and Deputy Director (Research) at the Institute of Microelectronics. His research interests are on analog and radio-frequency (RF) circuits and systems for wireless and multidisciplinary innovations.
His involvements with IEEE are: Editorial Board Member of IEEE Press ('14-'16); Member of Board-of-Governors of IEEE Circuits and Systems Society ('09-'11); Senior Editor of IEEE Journal on Emerging and Selected Topics in Circuits and Systems ('14-'15); Associate Editor of IEEE Journal of Solid-State Circuits ('18-), IEEE Solid-State Circuits Letters ('17-), IEEE Transactions on Circuits and Systems I ('10-'11, '14-'15) and II ('10-'13). He is/was the TPC Vice Co-Chair of ASP-DAC ('16), TPC Member of A-SSCC ('13-'16,'19), ESSCIRC ('16-'17) and ISSCC ('17-'19). He is/was Distinguished Lecturer of IEEE Circuits and Systems Society ('14-'15) and IEEE Solid-State Circuits Society ('17-'18). He was the chairman of the Distinguished Lecturer Program of IEEE Circuits and Systems Society ('18-'19).
Ka-Meng Lei received the B.Sc. degree in electrical and electronic engineering (EEE) and the Ph.D. degree in electrical and computer engineering (ECE) from the University of Macau, Macau, in 2012 and 2016, respectively. He has served as an Assistant professor at the University of Macau since 2019. He was a Postdoctoral Fellow at Harvard University from 2017 to 2019, where he was involved in developing the high-resolution portable nuclear magnetic resonance (NMR) spectrometer.
Ka-Meng Lei has published 60+ refereed papers. He co-authored one book Handheld Total Chemical and Biological Analysis Systems: Bridging NMR, Digital Microfluidics, and Semiconductors (Springer'18), and two book chapter Micro-NMR on CMOS for Biomolecular Sensing (Springer'18) and Ultra-Low-Voltage Clock References (Springer'23). His current research interests include ultralow voltage analog circuit techniques, sensors and analog front-end interfaces, and high-resolution portable NMR platforms.
Content
Introduction.- State-of-the-Art Resistor-Based Temperature Sensors Topology.- ULV and ULP Temperature Sensor for IoT-Driven.- Wire-Metal-Based Temperature Sensor for Technology-Scaling.-Conclusion and Outlook.
