Precision Assembly Technologies and Systems
6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012, Proceedings
Published on 7. February 2012
XII, 212 pages
978-3-642-28163-1 (ISBN)
Description
This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques.
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Svetan Ratchev
Precision Assembly Technologies and Systems
6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012, Proceedings
Book
02/2012
Springer
€53.49
Shipment within 7-9 days
Content
- Title page
- Preface
- Organization
- Table of Contents
- Micro Assembly Processes and Systems
- Development of a Micro-scale Assembly Facility with a Three Fingered, Self-aware Assembly Tool and Electro-chemical Etching Capabilities
- Introduction
- Standing Wave Probe Fingertips
- Positioning and Sensing for Fingertip Control
- Electrochemical Etching Facility
- Micro-CMM Probe Assembly
- References
- Semi-automated Assembly of a MEMS-Based Micro-scale CMM Probe and Future Optimization of the Process Chain with a View to Desktop Factory Automation
- Introduction
- Assembly Preparation and Tests
- Assembly Setup
- Camera Verification
- Experiment with UV Curing Adhesive
- Application of Adhesive to Triskelion
- Test Assembly of Stylus
- Final Assembly Process
- Results and Conclusion
- Future Work
- References
- Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench
- Introduction
- Case Study
- Design of Passive Alignment Features
- TriPleX
- InP
- Silicon Optical Bench
- Manufacturing Results
- Assembly Results
- Discussion
- Conclusion
- References
- Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment
- Introduction
- Parallel C-4 Bonding
- Process Overview
- Required Robotic Precision
- Space Saving
- Case Study
- Under Bump Metallurgy (UBM)
- Solder
- Process Steps
- Results
- Conclusions and Outlook
- References
- Processes for the Self-assembly of Micro Parts
- Introduction
- The Overall Process
- Surface Functionalization
- Droplet Deposition
- Device Placement
- Integration into a Roll-to-Roll Process
- Conclusion
- References
- Precisely Assembled Multi Deflection Arrays - Key Components for Multi Shaped Beam Lithography
- Introduction
- Multi Deflection Array - Assembly Requirements
- Multiple Apertures and Electrodes MEMS Technology
- LTCC Carrier System Platform
- Solder Bumping Fixation Technology
- Assembly of the MBD
- Summary
- References
- Handling and Manipulation in Assembly
- Construction Kit for Miniaturised Handling Systems: Further Developments and First Applications
- Purpose of the Paper
- Research Method
- Cooperation
- Outlook
- Major Results
- References
- Flexible Gripper System for Small Optical Assemblies - Final Tests and Findings
- Introduction
- Case Product
- Gripper System
- Gripper Design
- End Tools
- Integrated Camera Systems
- Tests and Findings
- Test Setup
- Test Results - Assembly Cycle Times
- Test Results - End Tools
- Discussion, Conclusions and Summary
- References
- Handling and Manipulation of Microcomponents: Work-Cell Design and Preliminary Experiments
- Introduction
- Experimental Setup
- Experimental Procedures
- Results and Discussion
- Conclusions
- References
- Adhesive Workpiece Fixturing for Micromachining
- Introduction
- Clamping Technology for Micro Production
- Concept of Adhesive Fixturing with Hot Melts
- Design
- Testing
- Summary and Outlook
- References
- Dual-Stage Feed Drive for Precision Positioning on Milling Machine
- Introduction
- The Dual-Stage Mechanism
- Design of Microstage for Fine Motion
- The Developed System
- Control Strategy
- Experiment on the Milling Machine
- Linear Trajectory Motion Test
- Circular Motion Test
- Conclusion
- References
- High Resolution Actuators for Severe Environments
- Introduction
- Motor Principle
- Benefits from Amplification
- Miniaturization
- Design
- Results
- Compatibilities
- Force Maximization into Space Environment
- Design
- Results
- Compatibilities
- Conclusions
- References
- Tolerance Management and Error Compensation Methods
- Tolerance Management for Assembly - Not a Matter of Product Size
- Introduction
- Basics of Tolerance Management for Assembly Processes
- Product Analysis
- Approach to Identify Admissible Tolerances
- Evaluation and Classification of Key Characteristics
- Process Analysis
- System Optimization
- Conclusions
- References
- Modelling and Analysis of the Geometrical Errors of a Parallel Manipulator Micro-CMM
- Introduction
- Structure and Theory
- Machine Design and Structure
- Coordinate System
- Development of the Kinematic Model
- Analysis of the Work Space
- Modelling of the Error
- Analytical Error Model
- Monte Carlo Simulation
- Results of the Error Model
- Effect of Structural Errors on Probe Position
- Concluding Remarks
- References
- Methods for Implementing Compensation Strategies in Micro Production Systems Supported by a Simulation Approach
- Introduction
- Production System Design in the Micro World
- Methods for Implementing a Compensation Strategy into a Micro Production System
- A Simulation Approach for Verification
- Description of the Model
- Simulation Results
- Conclusion
- References
- Metrology and Quality Control
- Accuracy Measurements of Miniature Robot Using Optical CMM
- Introduction
- Parallel Scara Robot
- Measurement Method
- Optical CMM
- Measurement Target
- Measuring Process
- Measurement Results
- Accuracy
- Conclusions and Future Work
- References
- A System for the Quality Inspection of Surfaces of Watch Parts
- Introduction
- Collaboration with Human Experts
- Overview of the System
- The Acquisition Setup
- The Image Processing and Classification Blocks
- Conclusion
- References
- Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding
- Introduction
- Test Setup
- Test Equipment
- Calibration
- Test Samples
- Fixed-Position Test
- Zero-Force Test
- Test Results
- Conclusions
- Discussion
- References
- Intelligent Control of Assembly Systems
- Towards Intelligent Assembly and Manufacturing Environment - Modular ICT Support for Holonic Manufacturing System
- Introduction
- State of the Art
- Data and Information Modeling
- Dynamic and Evolving Assembly Systems
- Modular ICT for Dynamic and Evolvable Systems
- Service View
- Common Information Exchange Layer
- Data Storage
- Laboratory Implementation
- Holonic Manufacturing System
- Implemented Operation Principles for HMS
- Core of the Modular ICT
- Conclusions
- References
- Enabling Fast Ramp-Up of Assembly Lines through Context-Mapping of Implicit Operator Knowledge and Machine-Derived Data
- Introduction
- Success Factors for Ramp-Up
- Approach and Methology
- Semantic Technologies in Manufacturing
- Ontologies
- Semantic Middleware
- Standards for Semantic Technologies
- Application for Precision Assembly Lines - Implementation and Verification
- Static Structural Model
- Dynamic Knowledge and Mapping Functionality
- Relationship Model and Reasoning
- Technical Implementation
- Verification
- Conclusion and Outlook
- References
- Accelerated Ramp-Up of Assembly Systems through Self-learning
- Introduction
- Related Work
- Ramp-Up Acceleration and Performance Indicators
- Machine Learning and the K-Nearest Neighbour Algorithm
- Methodology
- The FRAME Project
- The Knowledge Object Algorithm
- Synthetic Case Study
- Conclusions and Discussion
- References
- Process Selecting and Modelling Techniques
- A Methodology for Assessing the Cost Effectiveness of Assembly Processes
- Introduction
- Modelling Cost and Values Generated by Assembly Processes
- A Methodology for Assessing the Cost Effectiveness of Assembly Processes
- Case Application of Modelling Methodology
- Modelling the Assembly Processes for Cost and Value Analysis
- References
- Model Based Planning of Complex Micro-manufacturing Strategies
- Introduction
- Classification of Micro-manufacturing Processes
- Modelling in Micro-manufacturing
- Chaining of Micro-manufacturing Processes
- Example of Micro-pump
- Conclusions
- References
- Towards an European Approach for Characterisation of Multimaterial Micromanufacturing Process Capabilities
- Introduction
- EUMINAfab Information and Knowledge Management Framework
- Description Basics and Technology Capability Maps
- Assessment of Technologies
- Technical Aspects for Description of Technical Aspects
- Integration of All Aspects of Influence on "Competence" Level
- Modelling of Process Chains
- Implementation and Filling of the Database
- Information Management System
- Implementation in the MINAbase Online-Database
- Filling the Database
- Outlook
- References
- Author Index
