Handbook of Electronic Package Design
1st Edition
Published on 24. October 2018
904 pages
978-1-351-83841-2 (ISBN)
Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Reviews / Votes
"Prepared in a manner suitable for teaching and including end-of-chapter problems, this book well meets the needs for a teaching text. . ..Several useful appendices are also included. "---IEEE Book Review
More details
Series
Edition
1. Auflage
Language
English
Place of publication
London
United Kingdom
Publishing group
Taylor & Francis Ltd
Target group
Professional and scholarly
File size
33,48 MB
ISBN-13
978-1-351-83841-2 (9781351838412)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Michael Pecht
Handbook of Electronic Package Design
Book
08/1991
1st Edition
CRC Press
€526.14
Shipment within 15-20 days
Person
Content
"Introduction, Michael D. Osterman and Michael Pecht Electronic Components, Denise BurkusHarris, Michael Pecht, and Pradeep Lall Printed Wiring Board Design and Fabrication, Denise Burkus Harris and Pradeep Lall Electronic Assemblies, Denise Burkus Harris Interconnections and Connectors, Pradeep Lall and Michael Pecht Layout, Michael D. Osterman and Michael Pecht Thermal Design Analysis, Dennis K. Karr, David Dancer, and Milton Palmes, III Thermomechanical Analysis and Design, Abhijit Dasgupta Vibration and Shock Analysis and Design, Donald B. Barker Humidity and Corrosion Analysis and Design, Wing C. Ko and Michael Pecht Design for Reliability, Michael Pecht Electronic Materials and Properties, Jillian Y. Evans and John W. Evans Appendix A: Acronyms Used in Electronics Appendix B: Glossary of Hybrid Microcircuits Packaging Terms Appendix C: Standards and Specifications for Microelectronics Appendix D: Standards and Specifications for PCBs and PWBs Appendix E: Unit Conversion Tables "
