Electronic Packaging Interconnect Technology
Electronic Packaging Interconnect Technology Symposium (EPITS 2017)
Published on 13. April 2018
210 pages
978-3-0357-3324-2 (ISBN)
Description
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
More details
Series
Language
English
Place of publication
Zurich-Durnten
Switzerland
Target group
Professional and scholarly
Illustrations
Illustrations, unspecified
File size
74,69 MB
ISBN-13
978-3-0357-3324-2 (9783035733242)
DOI
10.4028/b-SD4kXZ
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Kazuhiro Nogita | Mohd Arif Anuar Mohd Salleh | Mohd Mustafa Al Bakri Abdullah
Electronic Packaging Interconnect Technology
Electronic Packaging Interconnect Technology Symposium (EPITS 2017)
Book
06/2018
Trans Tech Publications Ltd
€208.33
Shipment within 10-20 days
Kazuhiro Nogita | Mohd Arif Anuar Mohd Salleh | Mohd Mustafa Al Bakri Abdullah
Electronic Packaging Interconnect Technology
Electronic Packaging Interconnect Technology Symposium (EPITS 2017)
Software
06/2018
Trans Tech Publications Ltd
€193.08
Shipment within 10-20 days
Persons
Eds. Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir
Content
<ul><li>Preface</li><li>Chapter 1: Materials and Technologies for Soldering Processes in Electronics Industry</li><li>The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates</li><li>Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder</li><li>Formation of Cu<sub>6</sub>Sn<sub>5</sub>/(Cu, Ni)<sub>6</sub>Sn<sub>5</sub> Intermetallic Compounds between Cu<sub>3</sub>Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding</li><li>Grain Refinements of Cu<sub>6</sub>Sn<sub>5</sub> in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys</li><li>Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy</li><li>Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review</li><li>Influence of Bismuth in Sn-Based Lead-Free Solder - A Short Review</li><li>Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution</li><li>Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte</li><li>Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl Solution</li><li>Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid</li><li>Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification</li><li>Tensile Properties of Sn-Bi Lead-Free Solder Alloys</li><li>Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface</li><li>Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens</li><li>Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in Na?l Solution</li><li>STEM Analysis of Atom Location in (Cu, Au, Ni)<sub>6</sub>Sn<sub>5</sub> Intermetallic Compounds</li><li>Effect of Trace Elements on the Liquid Structure of Sn-Cu Alloys Investigated by High Energy X-Ray Diffraction</li><li>Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth</li><li>Chapter 2: Materials and Chemical Technologies</li><li>Palladium(II) Picoline Thiourea Complex as Homogenous Catalyst in Heck Cross-Coupling Reaction in the Formation of C=C Bond</li><li>Aloe Vera Liquid Crystal Emulsion and Characterization of its Physical Properties</li><li>Diffractografic Analysis of AISI 420 Steel</li><li>Synthesis, Characterization and Crystal Structure of Coordination Polymers Developed as Anion Receptor</li><li>Synthesis and Characterization of Ag/TiO<sub>2</sub> Thin Film via Sol-Gel Method</li><li>The Effect of Temperature on Anatase TiO<sub>2</sub> Photoanode for Dye Sensitized Solar Cell</li><li>Manganese Substituted Iron Titanate Particles with Enhancement Adsorption Capacity for Removal of Remazol Brilliant Blue R Dye</li><li>Evaluation of ICP-OES Method for Heavy Metal and Metalloids Determination in Sterile Dump Material</li><li>The Formation and Properties of Zeolite-A and Zeolite-X through Geopolymerisation of Metakaolin</li><li>Effect of Geopolymer Coating on Mild Steel</li><li>Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates</li><li>Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy</li></ul>
