Practical MMIC Design
1st Edition
Published on 1. January 2006
376 pages
978-1-59693-037-7 (ISBN)
Description
Monolithic microwave integrated circuits (MMICs) are used in a host of electronics from cellular phones and global positioning systems to missile systems and radar. They are prized for their high performance and reliability, but they can be costly and highly difficult to produce. Proper design is the key to minimizing these problems. This practical resource is filled with real-world design techniques and rules of thumb that engineers can use on the job everyday to decrease costs and improve production quality. Emphasizing practice over theory, this handy reference is filled with photos of real MMIC designs that show how design techniques have been successfully implemented in the field. In addition to circuit design, the book covers modeling, simulation, and testing, as well as selection of the appropriate production technology. This invaluable volume offers professionals a unique look into the day-to-day practices of MMIC production and the economics associated with it.
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Steve Marsh
Practical MMIC Design
Book
11/2006
Artech House Publishers
€138.50
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Content
- Practical MMIC Design
- Contents vii
- Foreword
- Preface xv
- 1 Introduction 1
- 1.1 Introduction to MMICs 2
- 1.2 The History of MMICs 3
- 1.3 The MMIC Advantage 6
- 1.4 Basic Design Process 7
- References 8
- 2 Component Technology and Foundry Choice 11
- 2.1 Active Components 12
- 2.2 Passive Components 31
- 2.3 Questions 50
- References 52
- 3 Foundry Use and Economics 57
- 3.1 Using a Foundry 57
- 3.2 Economics 61
- References 64
- 4 Simulation and Component Models 65
- 4.1 Simulation 66
- 4.2 Passive Component Models 76
- 4.3 Active Component Models 82
- 4.4 Questions 84
- References 85
- 5 Design 89
- 5.1 Impedance Matching and the Smith Chart 90
- 5.2 Passive Elements 108
- 5.3 Amplifiers 125
- 5.4 Oscillators 188
- 5.5 Mixers 194
- 5.7 Phase Shifters 210
- 5.8 Switched-Path Attenuators 213
- 5.9 Circuits with Digital Application 214
- 5.10 Millimeter-Wave Circuits 216
- 5.11 Yield Improvement 231
- 5.12 Questions 246
- References 250
- 6 Layout 261
- 6.1 Layout Files 262
- 6.2 Circuit Layout Process 264
- 6.3 Layout Checking 267
- 6.4 Chip Arraying 270
- 6.5 Mask Manufacture 274
- 6.7 Questions 277
- References 277
- 7 Processing Technology 279
- 7.1 Substrate Material Growth 280
- 7.2 Wafer Production 283
- 7.3 Surface Layers 283
- 7.4 Photolithography 285
- 7.5 Wafer Thinning 302
- 7.6 Through-Substrate Vias 304
- 7.7 Back-Face Metal 305
- 7.8 Chip Separation 306
- 7.9 Quality Assurance 306
- 7.10 Questions 308
- References 309
- 8 Test 313
- 8.1 Process Control and Monitoring (PCM) 313
- 8.2 The dc Test and Stability Problems 314
- 8.3 RF Testing and Calibration 315
- 8.4 Questions 319
- References 320
- Appendix: Answers to Questions 323
- Chapter 2 323
- Chapter 4 324
- Chapter 5 325
- Chapter 6 328
- Chapter 7 329
- Chapter 8 330
- Glossary 331
- About the Author 341
- Index 343
