Ultra Clean Processing of Silicon Surfaces V

Preface, Conference Organisation and Sponsors
Defects and Contamination in Microelectronic Device Production: State-of-the-Art and Prospects
The Effect of Ion Implantation on the Metal Contamination of Silicon Surfaces in Aqueous Solution
Barium, Strontium and Bismuth Contamination in CMOS Processes
An Exploration on the Bridge Formation Mechanism of Cylindrical Storage Poly-Silicon by Water Marks in High Performance 4Gigabit DRAM Capacitor
Chemical Processing and Materials Compatibility of High-K Dielectric Materials for Advanced Gate Stacks
Wettability Modification of Polysilicon for Stiction Reduction in Silicon Based Micro-electromechanical Structures
Dual Gate Oxide for 0.18?m Technologies and Below: Optimization of the Wet Processing Sequence
New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals
Metal Wet Cleaning with No Corrosion: A Novel Approach
Non-Contact Post Cu CMP Cleaning Using Megasonic Energy
Improved Phosphoric Acid Mixtures for Nitride Strip
Silicon Wafer Cleaning Processes Monitoring by the Surface Charge Profiler Method
New Aqueous Clean for Aluminum Interconnects: Part II. Applications
Synchronous Schlieren Image Analysis of Megasonic Single Wafer Cleaning
Dry Cleaning of Organic Contamination on Silicon Wafers Using Rapid Optical Surface Treatment
Materials Compatibility and Organic Build-Up during Ozone-Based Cleaning of Semiconductor Devices
Surface Characterization after Different Wet Chemical Cleans
A Hydrogenated Water Application to Semiconductor Manufacturing
Investigation of Trace Metals Analyses of Dry Residue on Silicon Wafer Surfaces by TXRF and ICP-MS
Electrochemical Study for the Characterization of Wet Silicon Oxide Surfaces
Pre-Diffusion Cleaning Using Ozone and HF
Novel Back Side Processes for Copper and Pre-Lithography Cleans
Optimisations of SC-1 Conditions for Sub 0.18?m Technologies in an Industrial Environment
Reduced Water Consumption for Post Clean Treatment and Metal Ion Contamination on VLSI Structures
Post SiN Etching Cleaning During Copper and Low K Integration
Wet Preparation of Defect-Free Hydrogen-Terminated Silicon Wafer Surface and Its Characterization in Atomic-Scale
Detection and Identification of Organic Contamination on Silicon Substrates
Preparation and Characterization of Time Dependent Haze on Silicon Surfaces
Single Chemistry Cleaning Solution for Advanced Wafer Cleaning
Behaviors of Metallic Contaminants in Si Wafer Processing
Iron Bulk Concentration Effect on the Yield & Reliability of Thin Oxides
Gap States at the Interface of Ultra-Thin Oxide and Organic Films on Si(100)
Modification of Low-K SiCOH Film Porosity by a HF Solution
Layer-By-Layer Oxidation of Silicon
The Evolution of Chemical Oxides Into Ultrathin Oxides: A Spectroscopic Characterization
Influence of Boron and Fluorine Incorporation on the Network Structure of Ultrathin SiO2
The Origins of Fluorine in Dry Ultrathin Silicon Oxides
Structural and Electrical Characterization of Ultra-Thin SiO2 Films Prepared by Catalytic Oxidation Method
Characterization of DI Water/O3 Oxidation of Si (100) and Si (111) Surfaces by OCP Measurements
Effect of Chemical Oxides Formed During Pre-Gate Oxide Cleaning on the Properties of Sub 20? Thick Ultra-Thin Stack Gate Dielectrics
Controlling Silicon Surface Roughness During Photochemical Cleaning
Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers
Characterization and Production Metrology of Thin Transistor Gate Dielectric Films
Electronic Properties of Wet-Chemically Prepared Oxide Layers
A Probe of Chemical Oxide Growth Conditions
Fundamentals of Wafer Rinse Processes and the Interactions with Water Conservation and Recycling in Semiconductor Manufacturing Plants
A Novel Rinsing Tank Concept to Save DI Water Using an Internal Recirculation Flow: 'Circle Stream Rinser'
Rinsing and Drying Effects on Heterogeneous Substrates
Low Consumption Front End of the Line Cleaning: LC-FEOL
New Single Wafer Double Sided Spin Cleaning Method
Determination of Photoresist Degradation Products in O3/DI Processing
The Ozone Solubility and its Decay in Aqueous Solutions: Crucial Issues in Ozonated Chemistries for Semiconductor Cleaning
Control of Ozonated Water Cleaning Process for Photoresist Removal
New Method to Generate the High Concentration Ozonated Water by Using the Ultrapure Water of the Semiconductor Factory
A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings
From Piranha to Barracuda: Mechanism of Ozone and Water Vapor Photoresist Strip in a Wet Bench
Photo Resist Stripping Using an Alkaline Accelerator Containing Wet-Vapor
Megasonic Silicon Wafer Cleaning and Its Influence on LSI Devices
Application of Megasonic Single Wafer Cleaning Technology to LSI Mass Production Line
Particle Removal Mechanism of Hydrogenated Ultrapure Water with Megasonic Irradiation
Megasonic, Non-Contact Cleaning Followed by 'Rotagoni' Drying of CMP Wafers
Particle Deposition Studies in Acidic Solutions
Particle Removal Efficiency Evaluation at 40 nm Using Haze Particle Standard
Use of Surfactants for Improved Particle Performance of dHF-Based Cleaning Recipes
The Role of Oxidant in HF-Based Solution for Noble Metal Removal from Substrate
Effect of Surface Charge and Fluid Properties on Particle Removal Characteristics of a Surface-Optimized REB Filter
Pattern Dependent Corrosion Effects in HF Based Post Cu CMP Cleanings
Effect of Copper on the Breakthrough Voltage of Poly-Si - Poly-Si Capacitors
New Insights into Particle Adhesion
SC-1 Clean Improvements for Post STI CMP
Contamination and Cleaning of Oxide Areas Exposed During Copper CMP in Hydroxylamine Based Slurries
Post Copper CMP: a Two Steps Cleaning Recipe
Silicon Surface Cleaning after Spacer Dry Etching
The Effect of DI Water and Intermediate Rinse Solutions on Post Metal Etch Residue Removal Using Semi-Aqueous Cleaning Chemistries
Wet Cleaning of Trenches and Vias after Oxide/Nitride Dry Etch with Cu Exposed