Ultra Clean Processing of Silicon Surfaces IV

<ul><li>Preface and Committees</li><li>The Rinsing Problem: Effect of Solute-Surface Interactions on Wafer Purity</li><li>Hydrogenated Ultrapure Water Production System for Future Wet Cleaning Process</li><li>Behaviour of Metallic Contaminants during Mos Processing</li><li>Hydrogen Peroxide Decomposition in Ammonia Solutions</li><li>New Aspects of the Diluted Dynamic Clean Process</li><li>Single Step Alkaline Cleaning Solution for Advanced Semiconductor Cleaning</li><li>Particle Removal Efficiency and Silicon Roughness in HF-DIW/O₃/Megasonics Cleaning</li><li>Industrial Trends in Wet Processing Technology</li><li>Particle Addition Behaviour of Oxide Stripping by HF Solutions</li><li>The Electrochemical Kinetics of Silicon Surface Corrosion in HF Containing Dilute Solutions</li><li>Influence of the Dissolved Gas in Cleaning Solution on Silicon Wafer Cleaning Efficiency</li><li>Optimization of Deionized Water Consumption in Wafer Wet Processing</li><li>Chemistry of the Silicon Oxide Surface: Adsorption from SC1 Solutions</li><li>Production of High Concentrations of Bubble-Free Dissolved Ozone in Water</li><li>Si-Purifier: A Point of Use Purifier for Noble Metals in HF Baths</li><li>Potassium Adhesion to Various CVD Oxide and the Surface Cleaning with Hot UPW</li><li>Production Performance of Single Tank Cleaning Processes for 0,25 ?m Technology</li><li>Ozonated DI-Water for Clean Chemical Oxide Growth</li><li>Ultra-Thin Oxide Growth on Silicon Using Ozonated Solutions</li><li>Gas-Phase Surface Processing Prior to 3.2 nm Gate Oxidation</li><li>Post Dry-Etch Cleaning Issues of an Organic Low-K Dielectric</li><li>Vapor Phase Decomposition - Droplet Collection: Can we Improve the Collection Efficiency for Copper Contamination?</li><li>Characterization of the Post Dry Etch Cleaning of the Silicon Surface Prior to Silicon Epitaxial Growth</li><li>Silicon Contamination Prevention in HF Mixtures</li><li>Applications of Tetramethylammoninium Hydroxide (TMAH) as a Post Tungsten CMP Cleaning Mixture</li><li>Fe and Cu Removal Efficiency in HF-DIW/O₃ Cleaning Sequence</li><li>Post Polysilicon Etch (Incorporating DUV Resist an BARC) Polymer Cleaning</li><li>Determination of Moisture / Water in Semiconductor Processing Liquids On-Line with the SemiChem Process Analyzer</li><li>Evaluation of Cleaning Recipes Based on Ozonated Water for Pre-Gate Oxide Cleaning</li><li>Characterization of Emitter Interface Oxide Growth in a Vertical LPCVD Polysilicon Deposition Reactor</li><li>Nitride Strip: Phosphoric Acid Bath-Life above 100 Hours</li><li>Wet Metal Etching for Ti/Co Self-Aligned Silicides</li><li>Post-Titanium-Salicide Cleaning with Spray Technology</li><li>XPS Study of the Cleaning Efficiency by Ozone Processes of the Protective Films Formed by Reactive Ion Etching of Co and Ti Silicide</li><li>Plasma Etch Residue and Photoresist Removal Utilizing Environmentally Benign Process Chemicals</li><li>Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning</li><li>Dynamics of Mass Transfer on a Wafer Surface in Ozonated-Water Processing for Photoresist Removal</li><li>Construction of the Distribution System for Ozonized Water Used in the Wet Cleaning of Si Wafer Surface</li><li>A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry</li><li>Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank</li><li>Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies</li><li>Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface</li><li>New Methods for Contamination Control and Dry Cleaning of Silicon Wafers</li><li>Wafer Backside Cleaning by Twin-Fluid Flow Cleaning</li><li>Evaluation of a Dry Laser Cleaning Process for the Removal of Surface Particles</li><li>Dependency of Micro Particle Adhesion of Dispersive and Nondispersive Interactions Analyzed by Atomic Force Microscopy</li><li>Integrated Cleaning: Application of Densified Fluid Cleaning (DFC) to Post-Etch Residue Removal</li><li>Application of Microcalorimeter EDS X-Ray Detectors to Particle Analysis</li><li>Surface Characterization in the Silicon Cleaning Process by a-UPC; Atmospheric Ultraviolet Photoelectron Counting</li><li>Microscopic Analysis of Particle Removal by Gas/Liquid Mixture High-Speed Flow</li><li>Kelvin-SPV Measurements of Atomically-Flat Si(111) Surfaces Contaminated with Metallic Ions</li><li>Comparison of Analytical Methods for Residue Detection of Resist Removal Processes</li><li>Dry Cleaning Technologies Using UV-Excited Radicals and Cryogenic Aerosols</li><li>A New HF Vapor Process for Native Oxide Removal, Suited for Cluster Applications</li><li>Silicon Surface Cleaning for Low Temperature Silicon Epitaxial Growth</li><li>Role of UV/Chlorine Exposure during Dry Surface Conditioning before Integrated Epi Deposition Process</li><li>Electrical Evaluation of the Epi/Substrate Interface Quality after Different In-Situ and Ex-Situ Low-Temperature Pre-Epi Cleaning Methods</li><li>Energy Loss of O1s Photoelectrons in Compositional and Structural Transition Layer at and near the SiO₂/Si Interface</li><li>Metal Enhanced Oxidation of Silicon</li><li>Effect of Si Surface Roughness on the Current-Voltage Characteristics of Ultra-Thin Gate Oxides</li><li>Infrared Absorption Studies of Wet Chemical Oxides: Thermal Evolution of Impurities</li><li>X-Ray Photoelectron Study of Gate Oxides and Nitrides</li><li>Evaluation of C₃F₈ as an In-Situ Cleaning Gas for PECVD Tools</li><li>Generation at Point-of-Use of BHF</li><li>Characterization of HF Cleaning of Ion-Implanted Si Surfaces</li><li>Determination of SC1 Etch Rates at Low Temperatures with Microscope Interferometry</li><li>Impact of Trace Metals in Litho Chemicals</li><li>Post Metal Etch Polymer Removal: An Investigation of Parameters that Influence Corrosion</li><li>A Process Using Ozonated Water Solutions to Remove Photoresist after Metallization</li><li>The Optimization of the Cleaning to Remove Residual Bonds of Si-C and Si-F after Fluorocarbon Plasma Etch on the Silicon Surface</li></ul>