
Radar RF Circuit Design
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Content
- Radar RF Circuit Design
- Contents
- Acknowledgments
- Part I Microwave Background
- 1 Crossing the Chasm from System to Component Level
- 1.1 Basic Radar Systems Overview
- 1.1.1 Radar Transmitters
- 1.1.2 Radar Receivers
- 1.1.3 Fundamental Equations
- 1.1.4 Requirements on Components
- 1.2 Introduction to Microwave Components
- 1.2.1 Fundamental Equations
- 1.2.2 Essential Components
- 1.3 Traveling Wave Tubes Versus Solid State
- 1.4 "How" Components are Connected Matters
- Exercises
- References
- Selected Bibliography
- 2 Introduction to Microwave Design
- 2.1 Scattering Matrix
- 2.2 Matching Networks
- 2.2.1 Quantifying Mismatch
- 2.2.2 Graphically Based Circuits
- 2.2.3 Distributed Matching Networks
- 2.3 Methods of Propagation
- 2.3.1 Wave Modes
- 2.3.2 Coaxial Cables (Coax)
- 2.3.3 Microstrip
- 2.3.4 Stripline
- 2.3.5 Coplanar Waveguide (CPW)
- 2.3.6 Waveguide
- 2.3.7 Discontinuities
- 2.4 Material Selection
- 2.4.1 Semiconductors
- 2.4.2 Metals
- 2.4.3 Ceramics
- 2.4.4 Polymers
- 2.4.5 New and Emerging Technologies
- Exercises
- References
- Selected Bibliography
- 3 Component Modeling
- 3.1 Passive Modeling
- 3.1.1 Capacitor
- 3.1.2 Inductor
- 3.1.3 Resistor
- 3.1.4 Resonators
- 3.2 Footprint Modeling
- 3.3 Transistor Modeling
- 3.3.1 Semiconductor Background
- 3.3.2 Basic Transistor Theory Review
- 3.3.3 Transistor Imperfections
- 3.4 Custom Models
- 3.5 Measurement Techniques
- Exercises
- References
- Selected Biblography
- Part II Component Design
- 4 Power Amplifier
- 4.1 Amplifier Basics
- 4.1.1 Class A
- 4.1.2 Class B
- 4.1.3 Class AB
- 4.1.4 Class C
- 4.1.5 Harmonically Matched Classes
- 4.1.6 Do Classes Really Matter?
- 4.2 Design Strategies and Practices
- 4.2.1 Stability
- 4.2.2 Power and Gain
- 4.2.3 Efficiency
- 4.2.4 Gain Flattening
- 4.2.5 VSWR
- 4.2.6 Conjugate Matching
- 4.2.7 DC Bias Filtering
- 4.2.8 Multistage Amplifiers
- 4.3 Broadband Amplifiers
- 4.3.1 Multisection Matching
- 4.3.2 Balanced Amplifier
- 4.3.3 Push-Pull Amplifier
- 4.3.4 Distributed Amplifiers
- 4.4 Balancing Linearity and Efficiency
- 4.4.1 Explanation of Linearity
- 4.4.2 Doherty
- 4.4.3 Other Linearization Techniques
- 4.5 Multiphysics Concerns
- 4.5.1 Thermal Considerations
- 4.5.2 Mechanical Considerations
- 4.6 LOs
- 4.7 Tubes, Solid-State, and Where They Overlap
- Exercises
- References
- Selected Bibliography
- 5 LNAs
- 5.1 Explanation of Noise
- 5.1.1 Thermal Noise
- 5.1.2 Shot Noise
- 5.1.3 Flicker Noise
- 5.1.4 Noise Terminology
- 5.2 Transistor Noise Modeling
- 5.3 Design Strategies and Practices
- 5.3.1 Understanding Noise Circles
- 5.3.2 LNA Design
- 5.3.3 Self-Bias Scheme
- 5.3.4 Gain Equalizers
- 5.3.5 Resistor Component Selection
- 5.4 High Dynamic Range
- 5.5 Cryogenic Operation
- 5.6 Limiter Elimination
- Exercises
- References
- Selected Bibiligraphy
- 6 Passive Circuitry
- 6.1 Limiting Factors and Ways to Mitigate
- 6.1.1 Lumped Elements
- 6.1.2 Bode-Fano Limit
- 6.1.3 Discontinuities
- 6.2 Couplers
- 6.3 Isolators and Circulators
- 6.4 Switches
- 6.5 Phase Shifters
- 6.6 Attenuators
- 6.7 Filters/Diplexers
- 6.8 Splitters/Combiners
- 6.9 Baluns
- 6.10 Mixers
- 6.11 Antennas
- 6.12 Current Density Analysis
- Exercises
- References
- Selected Bibliography
- Part III Higher-Level Integration
- 7 Microwave Integrated Circuits
- 7.1 Component Integration
- 7.1.1 MMIC
- 7.1.2 Hybrid
- 7.1.3 Multichip Modules (MCMs)
- 7.1.4 Packaging Options
- 7.2 Packaging Model
- 7.3 Designing for U.S. Military Standards
- 7.3.1 Robustness
- 7.3.2 Operating Stability
- 7.3.3 Environmental Considerations
- 7.3.4 Electrical Considerations
- 7.3.5 Mechanical Considerations
- 7.4 Designing for Pulsed Radar
- 7.4.1 Radar Terminology
- 7.4.2 Component Design
- 7.5 Taking Advantage of Simulators
- 7.5.1 Passives
- 7.5.2 Actives
- 7.5.3 Full-Electromagnetic (EM) Simulation
- 7.5.4 Manufacturing Assessment
- 7.6 Manufacturing Practices
- 7.6.1 Manufacturing Essentials
- 7.6.2 Engineering Practices for High Yield
- 7.6.3 Designing for MMIC-Level Cost Reduction
- 7.6.4 Designing for Module-Level Cost Reduction
- Exercises
- References
- 8 Transmit/Receive Module Integration
- 8.1 Integration Techniques
- 8.1.1 Physical Transitions
- 8.1.2 Wire and Ribbon Bonding
- 8.1.3 Proper Grounding
- 8.1.4 Achieving Compact Size
- 8.1.5 Component Placement
- 8.2 Preventing Oscillation
- 8.2.1 Even-Mode Oscillation
- 8.2.2 Odd-Mode Oscillation
- 8.2.3 Spurious Oscillation
- 8.2.4 Ground Loops
- 8.3 Preventing Crosstalk and Leakage
- 8.3.1 Electric Coupling
- 8.3.2 Magnetic Coupling
- 8.3.3 Shielding
- 8.4 Thermal Considerations
- 8.5 Mechanical Considerations
- 8.6 Module Simulation and Monte Carlo Analysis
- 8.7 Incorporating Digital into an RF Module
- 8.7.1 Common Digital Uses
- 8.7.2 Current Digital Infrastructure
- 8.7.3 Digital Radiation
- 8.7.4 Avoiding Mixed-Signal Issues
- Exercises
- References
- Selected Bibligraphy
- 9 On the Measurement Bench
- 9.1 Measurement Uncertainty
- 9.2 Test Fixture Design
- 9.2.1 De-Embedding Fixture Effects
- 9.2.2 Connectors, Adapters, and Cables
- 9.3 Tips for Making it All Work
- 9.3.1 Unstable Active Circuits
- 9.3.2 Incorrect Frequency Response
- 9.3.3 Radiation or Coupling
- 9.3.4 Low Gain or Output Power
- 9.3.5 High Loss
- 9.3.6 Catastrophic Damage at Initial Test
- 9.4 Transistor Stabilization
- Exercises
- References
- Selected Bibliography
- 10 Final Thoughts
- Appendix A
- A.1 Frequency Bands
- A.2 English-to-Metric Units Conversion
- A.3 Temperature Conversion
- A.4 Constants and Material Properties
- A.5 Math Functions
- About the Authors
- Index
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