IMAPS 2018
Emerald Publishing Limited
Published on 14. June 2019
52 pages
978-1-83867-668-1 (ISBN)
Description
The IMAPS is a non-profit making organization whose aim is to spread knowledge related to hybrid microelectronics; a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. The 42nd IMAPS Poland International Conference was held in Bialy Dom Hotel near Gliwice and took place between 23 and 26 September 2018. This event was organized by the Silesian University of Technology. The scope of the Conference covered everything in electronics between the chip and the system. In this special issue of Circuit World seven papers have been collected, covering the processes and procedures associated with PCB technology.
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Persons
Content
- Cover
- Guest editorial
- Joints realized by sintering of pressureless Ag paste
- Photonic curing of silver paths on 3D printed polymer substrate
- Investigation of inkjet printed path resistance in the context of manufacture and flexible application
- Electrical and rheological percolation threshold of graphene pastes for screen-printing
- Piezoresistive effect in embedded thick-film resistors
- Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
- Signal integrity in microelectronic hybrid systems made on metal substrates
