<ul><li>Acknowledgements and Introduction - Opening Remarks</li><li>Nitrogen Steels</li><li>New Powder Metallurgy Techniques for Fingerprint Detection</li><li>Measurement of Critical Properties in 2 1/4Cr1Mo Steel Using Miniature Disc Testing Procedures</li><li>Fracture Behaviour in Carbide Reinforced High Speed Steels</li><li>The Development of Methods for Assessing the Creep Crack Growth Behaviour of Materials in Elevated Temperature Hydrogen Service</li><li>Creep Deformation and Fracture Behaviour of Low Alloy Steel Weldments</li><li>Cryogenic Treatment of Three Heat-Treated Tool Steels</li><li>Material Requirements for Narrow Neck Press and Blow Plungers within the Glass Container Industry</li><li>The Unpredictable Behaviour of Aluminium and Some Stainless Steels in Certain Chemical Environments</li><li>The Bar Peeling of Nickel Based Alloys</li><li>Biaxial Flow and Fracture in a Metal Matrix Composite</li><li>Compaction Behaviour of Metal Matrix Composite</li><li>The Extrusion of Three Rapidly Solidified Powder Aloys Based on the Al-Mg-Li Ternary System</li><li>Finite Element Simulation and Experimental Investigation of Plane Strain Closed Die Forging</li><li>Mechanical Behaviour of Nylon at High Strain Rate and Room Temperature</li><li>Numerical Modelling of Heat Transfer during Overinjection of Thermoplastic Composite Materials</li><li>Development of a Shear Deformation Apparatus to Characterize the Interply Slip Mechanism of Advanced Thermoplastic Composites</li><li>Finite Element Analysis of a Thermoplastic Composite Sheet Forming Processes</li><li>Microstructure and Tensile Behaviour of a Long-Glass Fibre Reinforced Polyamide Component</li><li>Enhancing the Potencial of Polymeric Materials and Components for Reycling and Reclamation</li><li>Failure of Irradiated Polymers</li><li>Experimental Results for Polymer Coating of Fine Wires</li><li>Vacuum-Forming of Ceramic Fibre Furnace Modules</li><li>Fatigue Crack Growth in an Experimental Model of Femoral Fixation in the Artificial Hip Joint</li><li>Bone Structure and the Dynamics of Bone Adaptation in Response to Accumulative Damage</li><li>Structure Property Relationships in Glass Polyalkenoate Cements</li><li>Problems Associated with Experimental Accelerated Fatigue Testing of the Artificial Hip Joint</li><li>Micro-Scale and Nano-Scale Testing of Materials Using Scanned Probe Technologies</li><li>Surface Analysis of PVC/PMMA Blends</li><li>The Surface Analysis of Plasma Polymers Prepared from Saturated Precursors</li><li>Scanning Force Microscopy and Its Application to Engineered Materials</li><li>Development of a Digital Speckle Correlation System for Use in the Non-Destructive Testing of Advanced Engineering Ceramics</li><li>Indentation Induced Debonding of Magnetron Sputtered Silver Layers on Glass from Experimental and Finite Element Studies</li><li>Apatite-Mullite Glass-Ceramics</li><li>Sintering of Silicon Nitride Ceramics and Composites</li><li>Effect of Z-Value on Densification and Properties of Sialon-SiC Matrices and Composites</li><li>Development of a New Method for the R-Curve Determination of Ceramic Materials</li><li>Effects of Processing Variables on Microstructure Development of ZnO Ceramics for Varistor Applications</li><li>Influence of Heat Treatment, Dopant and Impurity Content on Creep Parameters of Superplastic Zirconia</li><li>A Critical Re-Evaluation of the Abrasive Wear of Brittle Solids</li><li>Simulation of Ion Beam-Induced Collisional Processes in Thin Film Titanium Silicide</li><li>Materials Engineering Aspects of Magneto-Optic Recording Materials</li><li>Preparation and Characterisation of Insulating Homogeneous Thick Films</li><li>Finite Element Thermal Modelling of the Laser Soldering Process</li><li>Visible and Infrared Optical Reflectance Spectroscopy of Silicon on Insulator Substrates</li><li>Investigation of the Influence of Gas Pressure on Dry-Etched Induced Damage on Semi-Insulating GaAs Substrates</li><li>Incoming Inspection of Silicon-on-Insulator Substrates Using Spectroscopic and Single Wavelength Ellipsometry</li><li>Acoustic Microscopy of Tape Automated Bonding (TAB) Tape for Interconnection and Packaging Applications</li><li>Materials Ireland-3RD Generation R & D Management</li></ul>