Introduction to Microsystem Technology
A Guide for Students
1st Edition
Published on 2. August 2008
376 pages
978-0-470-77092-4 (ISBN)
Description
Over half a century after the discovery of the piezoresistiveeffect, microsystem technology has experienced considerabledevelopments. Expanding the opportunities of microelectronics tonon-electronic systems, its number of application fields continuesto increase. Microsensors are one of the most important fields,used in medical applications and micromechanics. Microfluidicsystems are also a significant area, most commonly used in ink-jetprinter heads.
This textbook focuses on the essentials of microsystemstechnology, providing a knowledgeable grounding and a clear paththrough this well-established scientific dicipline. With amethodical, student-orientated approach, Introduction toMicrosystem Technology covers the following:
* microsystem materials (including silicon, polymers and thinfilms), and the scaling effects of going micro;
* fabrication techniques based on different material properties,descriptions of their limitations and functional and shape elementsproduced by these techniques;
* sensors and actuators based on elements such as mechanical,fluidic, and thermal (yaw rate sensor components aredescribed);
* the influence of technology parameters on microsystemproperties, asking, for example, when is the function of amicrosystem device robust and safe?
The book presents problems at the end of each chapter so thatyou may test your understanding of the key concepts (full solutionsfor these are given on an accompanying website). Practical examplesare included also, as well as case studies that enable a betterunderstanding of the technology as a whole. With its extensivetreatment on the fundamentals of microsystem technology, this bookalso serves as a compendium for engineers and technicians workingwith microsystem technology.
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Persons
Gerald Gerlach is currently a Professor for Solid-stateSensors at the Dresden University of Technology, Germany, a post hehas held since 1996. His research interests include micromachinedsolid-state sensors (pressure, humidity, chemical) and sensorfabrication techniques, and he teaches courses in Microtechnologyand Sensors. He has also held positions as a Researcher atdifferent German companies making micromachined pressure sensorsfor biomedical applications, and is active in the sensor andmeasuring technology fields, having been Chairman of the GermanAssociation of University Professors in Measuring Technology (AHMT)and Vice-President of the German Society for Measurement andControl (GMA) since 2002. He has co-authored the German version ofthis book Einführung in die Mikrosystemtechnik (Hanser,2006) and has contributed chapters to the book FunctionalElements in Precision Engineering (Hanser) and Fabricationin Precision Engineering and Microtechnology (Hanser, 1995). Hehas also written over 250 journal and conference papers, and holdsmore than 35 patents.
Wolfram Dötzel is currently Professor forMicrosystems and Precision Engineering at Chemnitz University ofTechnology, also holding the position of Vice-President forResearch at the university. His main research fields are in themodelling, design and simulation of micromechanical components,characterization and testing of micromechanical components byexperimental methods, and adaptation of methods and principles ofprecision engineering for microsystems. He teaches courses inMicrosystems, reliability and the design of devices and haspreviously co-authored Einführung in dieMikrosystemtechnik (Hanser, 2006) with Gerald Gerlach. He hasalso authored a chapter in the book Manual of DataAcquisition (Verlag Technik, 1984), more than 130 publicationsin journals and conference proceedings on micromechanical andprecision engineering components as well as modelling, simulation,and characterization, and holds 8 patents.
Content
Preface.
List of Symbols.
List of Abbreviations.
1 Introduction.
1.1 What is a Microsystem?
1.2 Microelectronics and Microsystem Technology.
1.3 Areas of Application and Trends of Development.
1.4 Example: Yaw Rate Sensor.
2 Scaling and Similarity.
2.1 Scaling.
2.2 Similarity and Dimensionless Numbers.
3 Materials.
3.1 Overview.
3.2 Single Crystalline Silicon.
3.3 Glasses.
3.4 Polymers.
3.5 Thin Films.
3.6 Comparison of Material Characteristics.
4 Microfabrication.
4.1 Overview.
4.2 Cleanliness During Production.
4.3 Lithography.
4.4 Thin-film Formation.
4.5 Layer Patterning.
4.6 Anisotropic Wet Chemical Deep Etching.
4.7 Doping.
4.8 Bonding Techniques.
4.9 Insulation Techniques.
4.10 Surface Micromachining.
4.11 Near-surface Micromachining.
4.12 HARMST.
4.13 Miniaturized Classical Techniques.
4.14 Selection of Microtechnical Manufacturing Techniques.
5 Packaging.
5.1 Tasks and Requirements.
5.2 Functions of Packaging.
6 Function and Form Elements in MicrosystemTechnology.
6.1 Mechanical Elements.
6.2 Fluidic Elements.
6.3 Thermal Elements.
7 Sensors and Actuators.
7.1 Reversible and Parametric Transducers.
7.2 Transducers for Sensors and Actuators.
8 Design of Microsystems.
8.1 Design Methods and Tools.
8.2 Systems with Lumped Parameters.
8.3 Systems with Distributed Parameters.
9 Effect of Technological Processes on MicrosystemProperties.
9.1 Parameter-based Microsystem Design.
9.2 Robust Microsystem Design.
10 The Future of Microsystems.
10.1 Status and Trends in Microsystem Technology.
10.2 Microoptical Applications.
10.3 Probe Tips.
10.4 RF Microsystems.
10.5 Actuators.
10.6 Microfluidic Systems.
10.7 Chemical, Biological and Medical Systems.
10.8 Energy Harvesting and Wireless Communications.
10.9 Micro Fuel Cells.
References.
Appendix A Physical Constants.
Appendix B Coordinate Transformation.
B.1 Elastic Coefficients.
B.2 Piezoresistive Coefficients.
References.
Appendix C Properties of Silicon Dioxide and Silicon NitrideLayers.
References.
Appendix D Nomenclature of Thin-film Processes.
Reference.
Appendix E Adhesion of Surface MicromechanicalStructures.
E.1 Capillary Forces.
E.2 Critical Length of Cantilever Springs.
Reference.
Index.
