VLSI Electronics Microstructure Science
Published on 1. December 2014
414 pages
978-1-4832-1774-1 (ISBN)
Description
VLSI Electronics: Microstructure Science, Volume 7 presents a comprehensive exposition and assessment of the developments and trends in VLSI (Very Large Scale Integration) electronics. This treatise covers subjects that range from microscopic aspects of materials behavior and device performance to the comprehension of VLSI in systems applications. Each chapter is prepared by a recognized authority. The topics contained in this volume include a basic introduction to the application of superconductivity in high-speed digital systems; the expected impact of VLSI technology on the implementation of AI (artificial intelligence); the limits to improvement of silicon integrated circuits; and the various spontaneous noise sources in VLSI circuits and their effect on circuit operation. Scientists, engineers, researchers, device designers, and systems architects will find the book very useful.
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Norman G. Einspruch
Very Large Scale Integration Electronics: v. 7
Book
12/1983
Academic Press
€101.07
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Content
¿List of ContributorsPrefaceChapter 1 Advanced Manufacturing Equipment for VLSI Lithography I. Introduction II. The Nature of the Lithographic Process III. Optical Lithography IV. Electron-Beam Microlithography V. X-Ray Lithography VI. Hybrid Lithography VII. Updated Position VIII. Other Considerations IX. Future Microlithographic Systems and Their Relation to the Factory of the Future X. Summary and Conclusion ReferencesChapter 2 Scaled MOS and Bipolar Technologies for VLSI I. Introduction II. Generic Processes for MOS and Bipolar VLSI III. MOS Scaling and Technology Implementation IV. Bipolar Scaling and Technology Implementation V. Conclusion ReferencesChapter 3 Laser Direct Writing for VLSI I. Introduction II. Instrumentation for Laser Direct Writing III. Laser Etching IV. Laser Deposition V. Laser Doping VI. Applications VII. Summary and Future Directions ReferencesChapter 4 Ultrathin-Gate Dielectric Processes for VLSI Applications I. Introduction II. Growth of Thin Oxides III. Characteristics and Characterization of Thin Oxides IV. Process-Related Issues V. Thin Oxides Related to Devices VI. Case for Alternative Dielectrics ReferencesChapter 5 Limits to Improvement of Silicon Integrated Circuits List of Symbols List of Acronyms I. Prefatory Remarks II. Introduction III. Physical Limits IV. Technological Limits V. Complexity Limits VI. Summary ReferencesChapter 6 Noise in VLSI I. Introduction II. Noise Sources in VLSI III. Noise Output of VLSI Building Blocks IV. Cross Talk V. a-Particle- and Cosmic-Ray-Induced Soft Errors in VLSI Circuits VI. Scaling ReferencesChapter 7 VLSI Computer Arithmetic for Real-Time Image Processing I. Introduction II. VLSI Arithmetic Modules III. Partitioned Matrix Algorithms IV. Pipelined Matrix Processors V. Real-Time Image Processing VI. Conclusions ReferencesChapter 8 Impact of VLSI on Artificial Intelligence I. Introduction II. Present-Day Capabilities III. Data- and Knowledge-Based Systems IV. Architectural Trends V. Likely Impact of VLSI on AI Systems VI. Summary and Assessment ReferencesChapter 9 Integrated Superconducting Electronics I. Introduction II. Origin of Technology III. Digital Devices IV. Structure and Fabrication V. Speed Considerations VI. Summary and Discussion ReferencesIndexContents of Other Volumes
