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Application Specific Integrated Circuit (ASIC) Technology explores and discusses the different aspects of the ASIC technology experienced during the 1990s. The topics of the chapters range from the ASIC business, model, marketing, and development up to its testability, packaging, and quality and reliability. An introductory chapter begins the discussion and tackles the historical perspective and the classification of the ASIC technology. Chapters 2 and 3 cover the business side of the technology as it discusses the market dynamics and marketing strategies. The following chapters focus on the product itself and deal with the design and model and library development. Computer-aided design tools and systems are included in the discussion. Manufacturing and packaging of ASICs are also given attention in the book. Finally, the last three chapters present the application, testability, and reliability of ASIC technology. The text can be of most help to students in the fields of microelectronics, computer technology, and engineering.
Language
Place of publication
Publishing group
Elsevier Science & Techn.
ISBN-13
978-0-323-15323-2 (9780323153232)
Schweitzer Classification
ContributorsPrefaceChapter 1 Introduction to ASIC Technology I. Overview II. Volume Summary ReferenceChapter 2 Market Dynamics of the ASIC Revolution I. Introduction II. Anatomy of the ASIC Revolution III. Market Forces Driving the ASIC Revolution IV. Factors Limiting ASIC Market Growth V. Profile of the ASIC Market VI. Fragmentation of the ASIC Market VII. Shifting Forces in the ASIC Market VIII. ConclusionChapter 3 Marketing ASICs I. Introduction II. The ASIC Product Framework III. The ASIC Market Framework IV. The Marketing Tool Set V. The ASIC Sales Strategy VI. Positioning for Success VII. Conclusion BibliographyChapter 4 Design and Architecture of ASIC Products I. Introduction II. Gate Array Design Methodologies and Architectures III. Cell-Based Design Methodologies and Architectures IV. Embedded Megafunction and Memory Design V. Requirements of Gate and Block Level Interconnect Technology VI. Testability Concepts VII. Future of ASIC Products and Architectures ReferencesChapter 5 Model and Library Development I. Introduction II. Model Development III. Library Development ReferencesChapter 6 Computer-Aided Design Tools and Systems I. Introduction II. A Brief History of ASIC CAD III. Low-Complexity Gate Array IV. High-Complexity Gate Array V. High-Complexity Cell-Based Designs VI. Mixed Analog/Digital Design VII. ASIC Internal Tools VIII. Who Makes Tools? IX. How Tools Are Created X. What is Missing? ReferencesChapter 7 ASIC Manufacturing I. Standard Product Circuit Design II. ASIC Design for Manufacturability III. Mask Making IV. Wafer Fabrication V. Testing VI. Assembly and Package Technology VII. Material and Inventory Management VIII. Emerging TechnologiesChapter 8 Test and Testability of ASICs I. Introduction II. The Test Cycle III. Problems in Testing IV. Test Solutions V. Test Trends VI. Conclusions ReferencesChapter 9 Electronic Packaging for ASICs I. Introduction II. Packaging Considerations When Using ASICs III. The Problems of Single-Chip Packaging and the Promise of Multichip Modules IV. Conclusion and Summary BibliographyChapter 10 Application and Selection of ASICs I. Identification of Potential Applications II. Technology III. Foundry versus the Turnkey Solution BibliographyChapter 11 Designing with ASICs I. Introduction II. An Overview of the ASIC Design Process III. Making the ASIC Decision IV. Facilitating the ASIC Design V. Design Methodology VI. ASIC Implementation VII. Summary ReferencesChapter 12 Quality and Reliability I. Introduction: Trends in Quality and Reliability II. Wafer Fabrication III. Packaging IV. Some Statistical Background of QA/QC and Reliability ReferencesIndex