EMPC/IMAPS 2017 Poland
Emerald Publishing Limited
Published on 30. August 2018
64 pages
978-1-78769-260-2 (ISBN)
Description
The IMAPS is a non-profit making organization whose aim is to spread knowledge relating to hybrid microelectronics; a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization. In this special issue of Microelectronics International, ten papers have been collected, covering the processes and procedures associated with LTCC technology, photovoltaics and LED issues.
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Content
- Cover
- Guest editorial
- Application of microwave heating in ceramic-based microfluidic module
- The investigation of basic microfluidic elements in LTCC structures
- Temperature transducer with frequency output made in LTCC technology
- High voltage applications of low temperature co-fired ceramics
- Capacitive touch sensor
- Multilayer thick-film ceramic for multichip modules with laser microvias
- Low temperature co-fired ceramics technology for active eddy current turbocharger speed sensors
- Borosilicate spray-on glass solutions for fabrication silicon solar cell back surface field
- Antireflective and passivation properties of the photovoltaic structure with Al2O3 layer of different thickness
- Smart LED high CRI lighting systems
