EMPC-IMAPS Poland 2018
Emerald Publishing Limited
Published on 28. June 2019
48 pages
978-1-83867-870-8 (ISBN)
Description
In the special issue of Soldering and Surface Mount Technology six papers have been collected (1 review and 5 research papers), covering the processes and procedures associated with soldering and assembly technology.
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Content
- Cover
- EMPC-IMAPS Poland 2018 - Guest Editorial
- Vapour phase soldering (VPS) technology: a review
- Measurement and regulation of saturated vapour height level in VPS chamber
- Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering
- Advances in pressure sensing for vapour phasesoldering process monitoring
- Non-Newtonian numerical modelling of solder paste viscosity measurement
- Experimental approach to thermal conductivity of macro solder joints with voids
