VLSI Electronics

List of ContributorsPrefaceContents of Other VolumesChapter 1 Manufacturing Process Technology for MOS VLSI I. Introduction II. Trends in Complexity III. Horizontal Scaling IV. Vertical Scaling V. Characterization and Process Control VI. Material VII. The Manufacturing Facility VIII. Summary ReferencesChapter 2 Principles of Optical Lithography List of Symbols I. Introduction II. Optical Exposure Techniques III. Photoresists and Substrates IV. The Characterization of the Lithographic Image v. Feature Size Control VI. Focal Tolerance VII. Overlay VIII. Conclusion Appendix Effect of f/Number and Wavelength on the Incoherent Focal Tolerance ReferencesChapter 3 Resolution Limitations for Submicron Lithography I. Introduction II. Ideal Properties III. Diffraction Effects IV. Scattering and Energy Loss V. Engineering Considerations VI. Statistical Considerations VII. Projections ReferencesChapter 4 Research and Resource at the National Submicron Facility I. Introduction II. Research Programs III. Resources IV. Future Directions for NRRFSS ReferencesChapter 5 Limitations of Small Devices and Large Systems I. Introduction II. Physical Nature of Information Processing III. Devices for LSI IV. Limits to Miniaturization V. Large Systems VI. Performance VII. Alternatives Appendix MESFETs ReferencesChapter 6 Physics and Modeling of Submicron Insulated-Gate Field-Effect Transistors. I I. Introduction II. The MOSFET III. Two-Dimensional Effects IV. Carrier Injection and Breakdown V. Carrier Transport ReferencesChapter 7 The Government Role in VLSI I. Introduction II. Department of Defense Programs III. Science Agency Programs IV. Policy Issues ReferencesChapter 8 VLSI, A Major New Tool for Productivity Improvement The Potential for Electronics in Manufacturing Productivity Appendix I. Estimating the Translog Cost Function for U.S. Manufacturing with Factor Augmentation Appendix II. Improving Productivity through the Use of AEGs-Eighteen Applications and Their Relationship to U.S. Manufacturing ReferencesIndex