Security and Privacy in Cyber-Physical Systems and Smart Vehicles
First EAI International Conference, SmartSP 2023, Chicago, USA, October 12-13, 2023, Proceedings
Published on 4. February 2024
XII, 172 pages
978-3-031-51630-6 (ISBN)
Description
This book constitutes the refereed proceedings of the First EAI International Conference, SmartSP 2023, held in Chicago, USA, during October 12-13, 2023.
The 11 revised full papers were carefully reviewed and selected from 24 submissions. The papers focus on all details all technological aspects that are relevant to Security and privacy in cyber-physical systems.
More details
Series
Edition
1st ed. 2024
Language
English
Place of publication
Cham
Switzerland
Publishing group
Springer International Publishing
Target group
Professional and scholarly
Product notice
Reflowable
Illustrations
XII, 172 p. 57 illus., 48 illus. in color.
File size
14,31 MB
ISBN-13
978-3-031-51630-6 (9783031516306)
DOI
10.1007/978-3-031-51630-6
Schweitzer Classification
Other editions
Additional editions
Yu Chen | Chung-Wei Lin | Bo Chen
Security and Privacy in Cyber-Physical Systems and Smart Vehicles
First EAI International Conference, SmartSP 2023, Chicago, USA, October 12-13, 2023, Proceedings
Book
02/2024
Springer
€69.54
Shipment within 15-20 days
Content
Exploring Vulnerabilities in Voice Command Skills for Connected Vehicles.- Enabling Real-Time Restoration of Compromised ECU Firmware in Connected and Autonomous Vehicles.- mmFingerprint: A New Application Fingerprinting.- Technique via mmWave Sensing and Its Use in Rowhammer Detection.- ADC-Bank: Detecting Acoustic Out-of-Band Signal.- Injection on Inertial Sensors.- An E?icient and Smooth Path Planner Based on Hybrid Embracing Semi-Supervised Domain Adaptation for Federated Knowledge Transfer.- A Lightweight Reputation System for UAV Networks.- Resilient Range-only Cooperative Positioning of Multiple Smart Unmanned Aerial Systems.- Securing the Future: Exploring Privacy Risks and Security.- Questions in Robotic Systems.- Waves of Knowledge: A Comparative Study of Electromagnetic and Power Side-Channel Monitoring in Embedded Systems.
