
Chemical Mechanical Polishing in Silicon Processing
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Content
- Front Cover
- Chemical Mechanical Polishing in Silicon Processing
- Copyright Page
- Contents
- Preface
- List of Contributors
- Chapter 1. Introduction
- I. CMP: A Unique and Evolving Semiconductor Fabrication Technology-Past, Present, and Future
- Chapter 2. Equipment
- I. Introduction
- II. CMP Equipment Design Evolution
- III. Carriers
- IV. Platens
- V. Pad Conditioning
- VI. CMP Equipment Integration
- VII. Copper Polishing and CMP Tool Requirements
- VIII. 300-mm CMP Tools
- IX. Conclusion
- References
- Chapter 3. Facilitization
- I. Introduction
- II. Outline
- III. Slurry Distribution System Overview
- IV. Slurry Handling
- V. Slurry Distribution Systems
- VI. Slurry Dispense Engines
- VII. Slurry Blending Technology
- VIII. Slurry Measuring Techniques
- IX. Daytank Replenishment
- X. Mix Order
- XI. Piping Systems
- XII. Piping System Variations
- XIII. Materials of Construction
- XIV. Slurry Settling
- XV. Slurry Room Location
- XVI. Pressure and Flow Consistency
- XVII. Back-Pressure Devices
- XVIII. Slurry Consumption Ramp
- XIX. System Redundancy
- XX. Valve Boxes
- XXI. Storage Tanks
- XXII. Agitation
- XXIII. Metrology
- XXIV. Filtration
- XXV. Slurry System Maintenance
- XXVI. Waste Disposal
- References
- Chapter 4. Modeling and Simulation
- I. Introduction
- II. Wafer-Scale Models
- III. Patterned Wafer CMP Modeling
- IV. Die-Level Modeling of Ild CMP
- V. Models for Metal Polishing
- VI. Summary and Status
- References
- Chapter 5. Consumables I: Slurry
- I. Introduction
- II. Abrasives
- III. Slurry Solution
- IV. Comparisons Among Slurries
- References
- Chapter 6. CMP Consumablesii: Pad
- I. Introduction
- II. Classes of Pads and Their Manufacture
- III. Structure, Properties, and Their Relationship to the Polishing Process
- IV. Application to Semiconductor Processing
- References
- Chapter 7. Post-CMP Clean
- I. Introduction
- II. Surface Configurations after CMP Processes
- III. Cleaning Requirements after CMP Processes
- IV. Corrosion Effects
- V. Slurry Removal
- VI. Metallic Contamination Removal
- VII. Damaged Layer Removal
- VIII. Final Passivation
- IX. Examples of Practical Post-CMP Cleaning Processes
- X. Conclusion
- References
- Chapter 8. CMP Metrology
- I. Introduction
- II. Reflectometry
- III. Defectivity Monitoring
- IV. Noncontact Capacitive Measurement
- V. Total X-Ray Fluorescence
- VI. Stylus Profilometry (Force Measurement)
- VII. Atomic Force Microscopy
- VIII. Four-Point Probe
- References
- Chapter 9. Applications and CMP-Related Process Problems
- I. Introduction
- II. Oxide CMP Within-Wafer Nonuniformity (WIWNU)
- III. Post-CMP Oxide Thickness Control
- IV. Defectivity
- V. Tungsten CMP Problems
- VI. Other Problems
- References
- Index
- Contents of Volumes in This Series
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