
Antenna-on-Chip
Description
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Content
- Intro
- Antenna-on-Chip: Design, Challenges, and Opportunities
- Contents
- Preface
- 1 Introduction to Antenna on Chip
- 1.1 Antennas and ICs: A Brief History
- 1.2 Circuit Integration Technologies
- 1.2.1 Interconnection Technologies
- 1.2.2 MCMs
- 1.2.3 SiP
- 1.2.4 SoP
- 1.2.5 SoC
- 1.3 On-Chip Antennas: Benefits and Opportunities
- 1.3.1 Cost and Size
- 1.3.2 The 50O Boundary: Not Needed Anymore
- 1.3.3 Integration and Robustness
- 1.3.4 Fabrication Precision and Repeatability
- 1.4 AoC: An Inevitable Choice for the Future
- 1.5 Conclusion
- References
- 2 Design and Implementation Challenges
- 2.1 Incompatible Silicon Substrate
- 2.1.1 Low Resistivity of Silicon
- 2.1.2 High Dielectric Constant of Silicon
- 2.1.3 Surface Waves
- 2.2 Limitations of the CMOS Stack-Up
- 2.3 Modeling and Simulation Challenges
- 2.3.1 Cosimulation Tools
- 2.4 Size and Layout Challenges
- 2.4.1 DRC
- 2.5 Fabrication Tolerances
- 2.6 Coupling and Interference Issues
- 2.6.1 Coupling from the Antenna to the Circuit
- 2.6.2 Coupling from Circuits to the Antenna
- 2.7 Characterization Challenges
- 2.7.1 Reflection from the Probe
- 2.7.2 Radiation of the Probe
- 2.7.3 Radiation Blockage or Shadowing
- 2.7.4 AUT Movement Restrictions
- 2.7.5 Measurement of Standalone Antennas
- 2.8 Packaging Challenges
- 2.9 Conclusion
- References
- 3 Radiation Enhancement and Measurement Techniques
- 3.1 Substrate Post-Processing Techniques
- 3.1.1 Substrate Thinning
- 3.1.2 High-Resistivity Substrates
- 3.1.3 Substrate Micromachining
- 3.2 On-Chip Reflecting Surfaces
- 3.2.1 AMCs
- 3.3 Off-Chip Techniques
- 3.3.1 Dielectric Superstrates
- 3.3.2 Artificial Dielectric Layers
- 3.3.3 Dielectric Resonator Loading
- 3.3.4 Dielectric Lens
- 3.4 3-D and MEMS-Based Antennas
- 3.4.1 Suspended Antennas
- 3.4.2 Vertical Monopoles
- 3.4.3 Movable Antennas
- 3.4.4 BWAs
- 3.5 Measurement and Characterization Techniques
- 3.5.1 Mitigating the Effects of On-Chip Circuits
- 3.5.2 Mitigating the Effects of Measurement Setup
- 3.6 Conclusion
- References
- 4 Codesign of Circuits and Antennas
- 4.1 Codesign Considerations
- 4.1.1 AoC in Receiver
- 4.1.2 AoC in Transmitter
- 4.1.3 AoC in the Transceiver
- 4.2 Choice of Transistor Technology
- 4.3 Impedance Matching
- 4.3.1 LNA-Antenna Matching
- 4.3.2 PA-Antenna Matching
- 4.3.3 T/R Switch-Antenna Matching
- 4.4 Circuit-Compatible Antenna Layout and Design
- 4.4.1 Size and Layout Codesign
- 4.4.2 Differential and Single-Ended Feeding
- 4.4.3 On-Chip Antennas with Added Functionality
- 4.5 Codesign to Prevent Antenna-Circuit Coupling
- 4.6 Antenna Circuit Cosimulation
- 4.7 Codesign of Package and Antenna
- 4.7.1 Packaging Design Considerations
- 4.7.2 Packaging Materials
- 4.7.3 Codesign for Performance Enhancement
- 4.8 Conclusion
- References
- 5 AoC Design Example
- 5.1 Design Flow
- 5.2 71-GHz Oscillator Transmitter with an On-Chip Monopole Antenna
- 5.3 Antenna Simulation
- 5.3.1 Substrate
- 5.3.2 Antenna Element
- 5.3.3 AMC
- 5.3.4 Superstrate Layer
- 5.3.5 Lens Integrated Package
- 5.4 Circuit Simulation
- 5.4.1 Adding a Design Library
- 5.4.2 Schematic Design
- 5.4.3 Layout Design
- 5.4.4 DRC
- 5.4.5 LVS
- 5.4.6 Parasitic Extraction
- 5.4.7 Post-Layout Simulation
- 5.5 Cosimulation
- 5.5.1 Simulating the Circuit in EM Simulator
- 5.5.2 Simulating the Antenna in the IC Simulator
- 5.6 Fabrication
- 5.7 Measurement and Characterization
- 5.7.1 Standalone Characterization
- 5.7.2 Active Characterization
- 5.8 Conclusion
- References
- 6 Future Trends in AoC
- 6.1 Performance Enhancement: A Continuing Challenge
- 6.2 Codesign and Multifunctional Role of AoC
- 6.3 Specialized Radios and Implantable Applications
- 6.4 Energy-Harvesting AoCs
- 6.5 Miniaturization of Low-Frequency AoCs
- 6.6 Terahertz Applications
- 6.7 MEMS and CMOS Codesign
- 6.8 Wireless Networks on Chip
- 6.9 Future Role of Foundries in AoC
- 6.10 Advances in Simulation and Measurement
- 6.11 Conclusion
- References
- Acronyms
- About the Authors
- Index
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