Newnes Electronics Assembly Handbook
Published on 30. June 2016
354 pages
978-1-4831-0537-6 (ISBN)
Description
Newnes Electronics Assembly Handbook
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Keith Brindley
Newnes Electronics Assembly Handbook
Book
02/1993
Butterworth-Heinemann
€21.07
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Person
Keith is a freelance journalist whose whole life (well, apart from the wife, the kids, the music and the mountain bike) is computers. He's been writing about them (computers, that is) for over 18 years, in the meantime working as a teacher, lecturer, engineer, journalist and finally (for the last 12 years) freelance in the computing field. He fondly remembers his first contacts with the Commodore Pet, the various Sinclair oddities, the BBC, PC-DOS, MS-DOS, the Mac, and the various incarnations of Windows. He dreams of new software and hardware, he realises that writing about computers makes little compared to making computers or writing the software for them, he is fully committed to passing his experience along to and making computer-life easier for his readers, yet still enjoys what he's doing. Which can't be all bad!
Content
- Front Cover
- Newnes Electronics Assembly Handbook
- Copyright Page
- Table of Contents
- Preface
- Chapter 1. Introduction
- Bringing together varied disciplines
- Applications
- Standardization
- Book layout and description
- Chapter 2. Electronics assembly: the PCB
- The printed circuit board
- Base materials
- Basic mechanical properties
- PCB manufacture
- PCB manufacturing processes
- Design
- Layout
- Through-hole PCB assembly
- Testing
- Cleaning of assemblies
- Conformal coatings
- Total automatic assembly
- Chapter 3. Electronics assembly: the SMA
- Surface mounted assemblies
- Advantages and disadvantages
- Surface mounted components
- Base materials
- Thermal design of surface mounted assemblies
- Design
- Assembly
- Assembly variations
- Testing assemblies
- Component placement
- References
- Chapter 4. Electromechanical assembly: packaging
- Packaging engineering
- Adhesives
- Thermal management
- Environmental considerations
- Electromagnetic compatability
- References
- Chapter 5. Soldering
- Changing face
- Requirements of the soldering process
- Solderability and protective coatings
- Soldering processes
- Solder
- Flux
- Types of joints
- Solder resists
- Hand soldering
- Mass CS soldering - wave soldering
- Mass SC reflow soldering
- Comparison of soldering processes
- Cleaning of PCBs
- References
- Chapter 6. Testing for quality
- The philosophy of quality
- Reliability
- Component parts testing
- Production processes
- The unpackaged assembly
- The packaged assembly
- References
- Chapter 7. Standardization of electronics manufacture: quality assurance
- Standards
- Reference to standards
- Levels of standards
- Standards organizations and bodies
- The work of BSI
- BITS
- BSS
- Assessed capability of companies
- Assessed quality of components
- Setting up company standards
- References
- Chapter 8. Selling to the Ministry of Defence
- MoD organization
- Procurement executive
- Procurement executive policy and procedures
- Quality assurance
- Glossary
- Appendix 1. Worldwide standards
- Appendix 2. Worldwide addresses
- Appendix 3. Further reading
- Index
