
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Springer (Publisher)
Published on 3. December 2010
Book
Paperback/Softback
X, 192 pages
978-1-4419-4873-1 (ISBN)
Description
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
More details
Edition
Softcover reprint of the original 1st ed. 2000
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Illustrations
X, 192 p.
Dimensions
Height: 244 mm
Width: 170 mm
Thickness: 12 mm
Weight
369 gr
ISBN-13
978-1-4419-4873-1 (9781441948731)
DOI
10.1007/978-1-4757-3159-0
Schweitzer Classification
Other editions
Additional editions

G.Q. Zhang | L.J. Ernst | O. de Saint Leger
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
E-Book
06/2013
Springer
€96.29
Available for download

G.Q. Zhang | L.J. Ernst | O. de Saint Leger
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Book
12/2000
Kluwer Academic Publishers
€106.99
Shipment within 15-20 days
Content
Simulation overview in the industry.- Thermal & mechanical problems in microelectronics.- Solder material characterization and modelling.- Polymer material characterisation and modeling.- Generic issues in numerical modeling.- Modeling of vapor pressure during reflow for electronic packages.- Simulation for fatigue, cracks and delamination.- Experimental validation of finite element modeling.- Perspectives of non-linear simulation.- Simulation-based optimisation in virtual thermo-mechanical prototyping of electronic packages.- Thermal fatigue reliability optimisation of Flip-Chip assemblies.- Product and Process Optimization with simulation.