Cover: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics - Springer

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Springer (Publisher)
Published on 3. December 2010
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Paperback/Softback
X, 192 pages
978-1-4419-4873-1 (ISBN)
€106.99incl. 7% vat
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