Advances In 3d Integrated Circuits And Systems
Published on 16. October 2015
Book
Paperback/Softback
392 pages
978-981-4699-01-3 (ISBN)
Description
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
More details
Series
Language
English
Place of publication
Singapore
Singapore
Target group
College/higher education
Professional and scholarly
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 21 mm
Weight
566 gr
ISBN-13
978-981-4699-01-3 (9789814699013)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
Content
TSV and TSI Device Fabrication; Device Modeling; Macromodeling; Power and Thermal Integrity; Power Ground Design; Clock-Tree Design; 3D IC Test; Compressive Sensing and Data Recovery; Power and Thermal Modeling; Microfludic Based Thermal Management; Power I/O Management; Signal I/O Bandwidth Management; Q-Learning; Signal I/O Voltage-Swing Management; 3D Sensor Design; CMOS Readout Circuit; I/O Buffer Design; I/O with Clock-Data Recovery; Multi-Core Microprocessor Design; Non-Volatile Memory;