Electrothermal Analysis of VLSI Systems
Published on 20. April 2013
Book
Paperback/Softback
XXIII, 210 pages
978-1-4757-7373-6 (ISBN)
Description
Electrothermal Analysis of VLSI Systems
addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Reviews / Votes
From the Foreword:` Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This text provides a comprehensive formulation of the electrothermal analysis problem beginning with a summary of the sources of power dissipation in CMOS circuits and followed by a formulation of the effect of temperature on MOS devices. '
Dr. Ralph K. Cavin, Vice President, Semiconductor Research Corporation
More details
Edition
Softcover reprint of the original 1st ed. 2000
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Illustrations
36 s/w Abbildungen
XXIII, 210 p. 36 illus.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 14 mm
Weight
371 gr
ISBN-13
978-1-4757-7373-6 (9781475773736)
DOI
10.1007/b117332
Schweitzer Classification
Other editions
Additional editions
Yi-Kan Cheng | Ching-Han Tsai | Chin-Chi Teng
Electrothermal Analysis of VLSI Systems
Book
06/2000
Kluwer Academic Publishers
€106.99
Shipment within 15-20 days
Content
The Building Blocks.- Power Analysis for CMOS Circuits.- Temperature-dependent MOS Device Modeling.- Thermal Simulation for VLSI Systems.- Fast-timing Electrothermal Simulation.- The Applications.- Temperature-dependent Electromigration Reliability.- Temperature-driven Cell Placement.- Temperature-driven Power and Timing Analysis.