Experimental Innovations in Surface Science

I. Vacuum System Technology.- A. Motion in Vacuum.- 1. Crystal Manipulator with Six Degrees of Motional Freedom.- 2. Rotation in Ultrahigh Vacuum.- 3. Crystal Positioning Using Capacitance.- 4. UHV Rotary Manipulator with Arcsec Resolution.- 5. Solenoid Driven Linear Motion Device.- 6. An Inexpensive Linear Motion Device.- 7. Translating Auger Spectrometer.- 8. Simple Multiple Motion Manipulator.- 9. Simple Device for Small Rotations in Ultrahigh Vacuum-Grating Application.- 10. Turntable Rotation in Ultrahigh Vacuum.- 11. Small Motions in UHV Systems Using Shape Memory Effect Alloys.- 12. Rotary Shutter Device Driven by Magnetic Eddy Current.- 13. High-Speed Ultrahigh Vacuum Motor.- 14. High-Speed Rotary Feedthrough for UHV Operation.- 15. Self-Lubricating Bearings in UHV.- 16. Lubrication for Heavy Sliding Loads in Ultrahigh Vacuum.- 17. Simple UHV Bearings for High-Speed Shafts.- 18. Flange-Mounted UHV Variable Aperture.- 19. Linear Motion Platform (LMP).- 20. Thermally Compensated STM with Repeatable Sample Positioning.- B. Sample Transfer.- 21. Sample Transfer from High Pressure to Ultrahigh Vacuum.- 22. Novel Sample Transfer from UHV Chamber to External Cell.- 23. UHV Sample Transfer Device with Low-Temperature Capability.- 24. Internal Cup High-Pressure Cell.- 25. High-Pressure Transfer Cell.- 26. Sample Transfer with Disconnect-I.- 27. Sample Transfer with Disconnect-II.- 28. UHV Access Port.- C. Electrical Connections.- 29. Tungsten Ribbon-Attachment to Power Leads.- 30. Wrap Connection-Tungsten to Tungsten.- 31. Cold-Formed Wire Connector.- 32. Ultrahigh Resistance Vacuum Feedthroughs.- 33. Sliding Metal Electrical Contact.- 34. Low-Profile Electrical Lead Clamp.- D. Pumping and Trapping.- 35. Water Aspirator/Sorption Pump Combination for Efficient UHV System Evacuation.- 36. Ballast Pumping-Vibration Free.- 37. The Use of Appendage Titanium Sublimation Pumps for Pumping Low Gas Loads in Ultrahigh Vacuum.- 38. Pressure-Equalizing Device in Complex Systems.- 39. Diode Ion Pump Performance in He Pumping.- 40. Vacuum Applications of Metal Foams.- 41. Cleaning of Ion Pumps by Chemical Etching.- 42. An Efficient Liquid Nitrogen Trap.- E. Bakeout.- 43. Bakeout of Metal Ultrahigh Vacuum Systems.- F. Behavior of UHV Systems.- 44. Wall Passivation in Stainless Steel Ultrahigh Vacuum Systems.- 45. Minimizing Wall Reactions in Ultrahigh Vacuum Systems-Gas Dosers.- G. Mechanical Action on Samples.- 46. Simple UHV Crystal Cleaver.- 47. Piezoelectric Fatigue Apparatus for UHV Operation.- H. Gasket Seals.- 48. Gasket Seals for Ultrahigh Vacuum Systems.- 49. Cryogenic Gasket Seals.- 50. Copper Gasket Removal Devices.- 51. Unconventional Compression Seals for Ultrahigh Vacuum.- I. Leak Repairs and Detection.- 52. Coaxial Pumped He Leak Detection Probe.- 53. Temporary Leak Sealing of Welded Bellows.- 54. Atmospheric Permeation-Viton O-Ring.- J. Specialized UHV Systems.- 55. Aluminum Ultrahigh Vacuum System.- 56. Surface Electrochemistry Apparatus.- II Mechanical Fabrication Techniques.- A. Grids.- 57. Hemispherical Grids-Formation and Piercing.- 58. Making Flat Mesh Grids of Large Size.- 59. Grid Fabrication Techniques-Conical Grid.- B. Conductive Coatings.- 60. Deposition of Electrically Conductive SnO2 Films.- C. Phosphor Screens.- 61. Sedimentation Method for Depositing Phosphor Screens.- 62. Dusting Method for Coating Phosphor Screens.- D. Thermionic Emitters.- 63. Thoriated Thermionic Emitters.- 64. Lanthanum Hexaboride Thermionic Emitters-Deposition on Metals.- 65. Directly Heated Lathanum Hexaboride Thermionic Emitters.- 66. Thermionic Emitter Mounting.- 67. Indirectly Heated Cathodes for High-Temperature Operation.- 68. Replacing Filaments in Glass Bayard-Alpert Gauges.- E. Shielding.- 69. Magnetic Shielding in Ultrahigh Vacuum.- 70. Electrical Isolation of UHV Components.- F. Single Crystal Fabrication/Orientation.- 71. Single Crystal Orientation, Grinding, and Polishing.- 72. A Simple Goniometer for Cutting Single Crystals.- 73. Ion Beam Polishing of Crystals to Subnanometer Roughness.- 74. Crystal Optical Alignment.- 75. Measurement of the Angles of Incidence in a LEED Experiment.- 76. Measurement of Angle of Incidence of an Electron Beam on a Single Crystal.- G. Tip Fabrication.- 77. Fabrication of Metal Tips Using Zone Electropolishing.- 78. Etching STM Tips Reproducibly.- 79. Sharpening Single Crystal Metal Tips by Ion Bombardment.- H. Spot-Welding.- 80. Spot-Welding Difficult Junctions.- I. Mechanical Procedures.- 81. Stretching Thin Metal Foils to a Wrinkle-Free Condition.- 82. Making Micron-Size Holes for Supersonic Nozzles.- 83. Straightening and Braiding Wires.- III. Measurement Methods.- A. Electrons.- 84. Electron Gun Design and Behavior.- 85. Low-Energy Electron Gun for Broad Beam Irradiation.- 86. Low-Energy Electron Gun for Broad Beam Irradiation-Cylindrical Symmetry.- 87. Electron Energy Analyzers.- 88. Electron Spectrometer Calibration Using Graphite.- 89. Measurement of Electron Beam Angular Divergence.- 90. Spot Photometer for LEED Intensity Measurements.- 91. Modified Faraday Cup for Electron Current Measurement.- 92. Rejuvenation of Cu/Be Electron Multipliers.- 93. Geiger-Müller Counter for Inverse Photoemission.- B. Ions.- 94. Ion Sputter Gun with Low Gas Emission.- 95. Alternate Ion Bombardment Sources.- 96. Ion Gun Based on Bayard-Alpert Gauge.- 97. Sputter Ion Gun-Cold Cathode.- 98. Broad Ion Sources-Improved Stability with Oxygen.- 99. Focusing of Low-Energy Ions by Magnetic Field.- 100. Measuring Ion Beam Dimensions.- 101. Beam Position Monitor-Charged Particles.- 102. Pulse-Counting LEED/ESDIAD Analyzer-Using MicroChannel Plate Detection.- 103. Time-of-Flight Detection for Laser-Ionized Neutrals.- C. Photons (UV).- 104. Hollow Cathode Resonance Lamp for He(II) (40.8eV) Photoemission.- 105. He(I) and He(II) Ultraviolet Resonance Source.- 106. Photochemistry on Surfaces Using an Ultraviolet Lamp.- 107. Use of Polarized Ultraviolet Light for Photochemistry.- D. Kinetics of Adsorption/Adsorbate Coverages.- 108. Absolute Adsorption Uptake Measurements from a Calibrated Effusive Molecular Beam.- 109. Measurement of Absolute Sticking Coefficient at Desorption Temperature.- E. Mass Spectrometry.- 110. Shielded Quadrupole Mass Spectrometers-Temperature-Programmed Desorption.- 111. Enhanced Signal-to-Noise in Quadrupole Mass Spectrometers.- 112. Elimination of Spurious Electron Emission from a Quadrupole Mass Spectrometer.- 113. Ta Mass Spectrometer Filament.- 114. Mass Spectrometer Calibration by Molecular Decomposition.- F. Temperature-Programmed Desorption/Reaction.- 115. Thermal Desorption-Angular Resolved.- 116. Magic-Angle Thermal Desorption Mass Spectroscopy.- 117. High-Temperature Thermal Desorption Spectroscopy.- 118. Scanning Kinetic Spectroscopy-A Survey Method for Investigation of Surface Reaction Processes.- 119. Temperature-Programmed Reaction Spectroscopy.- G. Gas Chromatography-Enhanced Sensitivity.- 120. Gas Chromatography-Sensitivity Enhancement.- H. Work Function.- 121. Work Function Changes Using Retarding Diode Method.- 122. Work Function Measurements Using an Electron Gun.- 123. Work Function and Electron Reflection Coefficient Measurements with the Shelton Diode.- 124. Improved Piezoelectric Drive Kelvin Probe.- 125. Improved Electromagnet Drive Kelvin Probe.- 126. Kelvin Probe-High Temperature Flow Reactor.- I. Radioactive Adsorbates.- 127. Radiotracer Techniques for Surface Studies.- J. Thin Film Deposition.- 128. Thin Film Deposition to Absolute Surface Coverages.- 129. Ionization Gauge Measurement of Film Evaporation Rate.- 130. Reusable Quartz Crystals for Film Thickness Measurement.- 131. Hybrid Thin Film Deposition Processes-Stable and Metastable Films.- 132. Sputter-Coating Inner Walls of Tubes.- K. Infrared Spectroscopy.- 133. Infrared Reflection Absorption Spectrometer.- 134. IRAS Measurements at High Pressure.- 135. Internal Reflection IR Spectroscopy-Silicon.- 136. Internal Reflection IR Spectroscopy-Gallium Arsenide.- 137. Infrared Spectroscopy-Continuous Pumping of Detector Dewar.- L. Calorimeteric Heats of Adsorption-Single Crystals.- 138. Measurement of the Calorimetrie Heat of Adsorption on Ultrathin Metal Single Crystals.- M. Surface Debye Temperature.- 139. Measuring the Surface Debye Temperature of a Single Crystal.- N. Friction.- 140. UHV Tribometer for Measuring the Coefficient of Friction.- 141. Pin-on-Disk Measurement-UHV.- IV. Thermal Control.- A. Heating Samples.- 142. Electronic Temperature Programmer-Metal Crystals.- 143. Temperature Programming of Metal and Semiconductor Crystals.- 144. Mounting Nonweldable Crystals for Resistive Heating and Cooling.- 145. Strain Free Single Crystal Mounting-Azimuthal Motion.- 146. Heating Silicon Crystals and Temperature Measurements.- 147. Avoiding Extraneous Electrical Effects Owing to Heating Crystals.- 148. Electron Bombardment Crystal Heating.- 149. Indirect Sample Heating.- 150. Indirect Heating of Compound Semiconductors.- 151. Heating Design-Insulator Crystals.- 152. Cement Mounting-Semiconductor Crystals.- 153. Low-Stress Mount for Fragile Semiconductor Crystals.- 154. Radiation Heating of Crystals through Glass Windows.- 155. Pyrolytic Graphite Heating Element for UHV.- 156. Heater-Paint-on Type.- 157. Mounting High-Temperature Tungsten Filaments.- B. Cooling Samples.- 158. 6 K-Cryogenic Crystal Holder.- 159. Cooling Crystals by Contact with a Thermal Reservoir.- 160. Cooling Samples on Manipulators-Thermal Conductivity Issues.- 161. Vacuum-Jacketed Cryogenic Manipulator Rod.- 162. Manipulator Component with Cryogenic Azimuthal Rotation.- 163. Cooling Using Direct Contact.- 164. Cooling Reservoir-Horizontal Manipulator.- 165. Cryogenic Connections.- 166. Sample Cooling Using Thermal Braid.- 167. Flexible Cooling Reservoir.- 168. Enhanced Cooling Using Liquid Nitrogen.- 169. Level Alarm-Liquid Nitrogen.- 170. Gas Thermal Switch.- C. Temperature Measurements.- 171. Tungsten-Rhenium Thermocouples-Calibration Over a Wide Temperature Range.- 172. Measuring Temperatures of Hot Filaments.- 173. Pyrometric Measurement of Temperatures.- 174. Pyrometer Measurements Through Windows Coated Inadvertently with Variable-Thickness Thin Films.- 175. Calibration Point for Optical Pyrometer Used for Silicon.- 176. Control of Silicon Temperature Using Resistivity.- V. Delivery of Adsorbates to Surfaces.- A. Gases.- 177. Design and Performance of Microcapillary Array Beam Doser.- 178. Gas Handling System for Array Beam Doser.- 179. Calibration and Use of Array Beam Doser.- 180. Beam Doser Shutoff-Condensable Gases.- 181. Neutral Beam Intensity Measurement Using a Stagnation Detector.- 182. Low Deadspace Aperture Valve for Repetitive Gas Dosing.- 183. Gas Flow Regulation-Squeeze Valve.- B. Evaporation Sources.- 184. Degassing Evaporation Sources.- 185. Metal Evaporation Sources for Downward Evaporation.- 186. Ultralow Coverage Metal Evaporation.- 187. Congruent Evaporation of Multicomponent Materials.- 188. Evaporator for Eutectic-Forming Metals.- 189. Simple Lithium Metal Evaporation Source.- 190. Aluminum Evaporation Sources-Long Lived.- 191. Cr Evaporator Sources of Compact Design.- 192. Electron Beam Evaporator for Refractory Materials.- 193. Small Electron Beam Evaporator for Refractory Metals.- 194. Electron Beam Evaporator.- 195. Break-Seal Ampoule Doser.- 196. Cadmium Sulfide Evaporation Source.- 197. Arsenic Atom Source.- 198. Vapor Deposition of Organic Thin Films.- C. Ions.- 199. Solid State Cesium Ion Gun Source.- 200. Alkaline Earth Metal Ion Sources.- D. Active Gases and Species.- 201. High Flux Atomic Hydrogen Sources-Thermal.- 202. Atomic Hydrogen Beam Source-Radio Frequency Driven.- 203. Atomic Fluorine Source.- 204. Alkali Metal Sources.- 205. Thermal Source of Methyl Free Radicals.- 206. Production, Storage, and Use of Ozone.- 207. Detection of Ozone or Atomic Oxygen by Oxidation of Silver Films.- E. Electrochemical Sources.- 208. Electrochemical Sulfur Source.- 209. Electrochemical Halogen Sources.- F. Gas Purification.- 210. Gas Purification for Experiments at High Pressures.- 211. Production and Purity Measurement for Extremely Pure He.- 212. Purification of Gases by Cryogenic or Gettering Methods.- 213. Gas Purification by Permeation Through Metals.- 214. O2 Source-Solid State.- 215. Reusable Sample Holder for Hydrogen Permeation Studies.- VI. UHV Windows.- A. Spectroscopic Windows.- 216. Mounting Infrared Windows on UHV Systems.- 217. Windows for Vacuum UV Transmission into Ultrahigh Vacuum Systems.- 218. Construction of Be Windows for Ultrahigh Vacuum Use.- 219. Bakeable Aluminum Ultrahigh Vacuum Window.- 220. Metal Thin Foil Windows-Welding.- 221. Preparation of Large-Area Si Single Crystal Windows.- 222. Strain-Free Optical Window Mounting.- B. Observation Windows.- 223. Shielded Observation Window.- 224. Heated Internal Window for Prevention of Film Deposition.- 225. UHV Glass Window Seal-Low Optical Distortion.- 226. Zero Length Window Assembly.- VII. Surface Preparation Methods.- A. Cleaning Metal and Semiconductor Crystals-Examples.- 227. Surface Segregation and the Cleaning of Metal Single Crystals.- 228. Chemical Method to Measure and Remove Carbon from Pd.- 229. Surface Cleaning Procedures-Silicon.- VIII. High-Area Solids.- A. Infrared Cells.- 230. Infrared Cell for Adsorption Studies on Supported Catalysts.- 231. Wide-Temperature-Range IR Cell for High-Area Solids.- B. Adsorption/Desorption-Thermal.- 232. Adsorption and Desorption from High-Area Solids.- 233. Microcalorimetric Studies of Adsorption Heat on Powders.- IX. Safety.- A. Protecting the Vacuum System.- 234. Delay Circuit for Turbopumping Protection Against Vacuum Loss from Power Interruptions.- 235. Fast-Closing Beam Valve for UHV Chamber Protection.- 236. Safety System for Oil Diffusion-Pumped UHV Systems.- 237. Folding Linear Magnetic Translator.- B. Protecting Personnel.- 238. Electrical Shocks in the Laboratory.- 239. Accidental Electrical Charging from Ionization Gauge.- Appendixes.- Appendix A. Useful Books-Experimental Surface Science Methods.- Appendix B. Manufacturers.- I. United States, United Kingdom, and Canada.- II. Germany and Europe.- III. Japan.