Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Methods
Published on 1. September 2011
Book
Paperback/Softback
298 pages
978-1-243-58970-5 (ISBN)
More details
Language
English
Place of publication
United States
Product notice
Paperback (trade)
Unsewn / adhesive bound
Illustrations
colour illustrations
Dimensions
Height: 254 mm
Width: 203 mm
Thickness: 20 mm
Weight
594 gr
ISBN-13
978-1-243-58970-5 (9781243589705)
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Schweitzer Classification